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Filing Detail
Form 424B5 - Prospectus [Rule 424(b)(5)]:
SEC Accession No. 0001193125-22-148184
Filing Date
2022-05-12
Accepted
2022-05-12 09:16:17
Documents
4

Document Format Files

Seq Description Document Type Size
1 424B5 d323821d424b5.htm 424B5 693326
2 GRAPHIC g323821g00m01.jpg GRAPHIC 35549
3 GRAPHIC g323821g00m14.jpg GRAPHIC 96613
4 GRAPHIC g323821g10a10.jpg GRAPHIC 29659
  Complete submission text file 0001193125-22-148184.txt   910170
Mailing Address HIGH TECH CAMPUS 60 EINDHOVEN P7 5656 AG
Business Address HIGH TECH CAMPUS 60 EINDHOVEN P7 5656 AG (31)402745678
NXP B.V. (Filer) CIK: 0001396945 (see all company filings)

IRS No.: 000000000 | State of Incorp.: P7 | Fiscal Year End: 1231
Type: 424B5 | Act: 33 | File No.: 333-263733-02 | Film No.: 22916001
SIC: 3674 Semiconductors & Related Devices

Mailing Address 2711 CENTERVILLE ROAD, STE. 400 WILMINGTON DE 19808
Business Address 2711 CENTERVILLE ROAD, STE. 400 WILMINGTON DE 19808 (1)2125360620
NXP Funding LLC (Filer) CIK: 0001397157 (see all company filings)

IRS No.: 000000000 | State of Incorp.: DE | Fiscal Year End: 1231
Type: 424B5 | Act: 33 | File No.: 333-263733-01 | Film No.: 22916000
SIC: 3674 Semiconductors & Related Devices

Mailing Address HIGH TECH CAMPUS 60 EINDHOVEN P7 5656AG
Business Address 31 6 54 265349
NXP Semiconductors N.V. (Filer) CIK: 0001413447 (see all company filings)

IRS No.: 000000000 | Fiscal Year End: 1231
Type: 424B5 | Act: 33 | File No.: 333-263733 | Film No.: 22915999
SIC: 3674 Semiconductors & Related Devices

Mailing Address HIGH TECH CAMPUS 60 EINDHOVEN P7 AG 5656
Business Address HIGH TECH CAMPUS 60 EINDHOVEN P7 AG 5656 31 40 27 26787
NXP USA, Inc. (Filer) CIK: 0001916620 (see all company filings)

IRS No.: 000000000
Type: 424B5 | Act: 33 | File No.: 333-263733-03 | Film No.: 22916002