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Acquisitions and divestitures other than National (Details) (USD $)
In Millions, unless otherwise specified
1 Months Ended 12 Months Ended 1 Months Ended 12 Months Ended
Nov. 30, 2010
Dec. 31, 2011
Dec. 31, 2010
Dec. 31, 2009
Oct. 31, 2010
mm
Aug. 31, 2010
mm
facilities
Oct. 31, 2010
Acquisition of semiconductor manufacturing site and 200-millimeter wafer fabrication facility [Member]
Aug. 31, 2010
Acquisition of wafer fabrication facilities and 200-millimeter equipment [Member]
Aug. 31, 2010
Acquisition of 300-millimeter production tools accounted for as a capital purchase [Member]
Dec. 31, 2009
Acquisition of luminary micro [Member]
Dec. 31, 2009
Acquisition of CICLON Semiconductor Device Corporation [Member]
Aug. 31, 2010
Minimum [Member]
mm
Aug. 31, 2010
Maximum [Member]
mm
Business Acquisition [Line Items]                          
Wafer fabrication facility, fully equipped and operational, millimeter         200                
Cash paid in business acquisition   $ 5,425 $ 199 $ 155     $ 140 $ 59   $ 51 $ 104    
Portion of acquisition allocated to property, plant and equipment             158 42          
Portion of acquisition allocated to inventory             5 9          
Portion of acquisition allocated to other net assets and liabilities             4            
Portion of acquisition allocated to expenses recorded in costs of revenues             8 8          
Acquisition-related costs recorded to selling, general and administrative             2 1          
Contractual agreement settlement recorded as cost of revenues               12          
Cash paid in acquisition recorded as a capital purchase                 58        
Other consideration in business acquisition                   7 7    
Proceeds from divested product line 148                        
Recognized gain on sale of product line 144                        
Total consideration given for acquisition of two wafer fabrication facilities and equipment in Aizu-Wakamatsu, Japan under a court-approved plan of reorganization           $ 130              
Wafer fabrication facility, operational, millimeter           200              
Wafer fabrication facility, non-operational, held for future capacity expansion, millimeter                       200 300
Number of wafer fabrication facilities acquired in Aizu-Wakamatsu           2