The Company	12 Months Ended
Dec. 31, 2011
The Company [Abstract]
The Company	The Company TriQuint Semiconductor, Inc. (collectively with its wholly owned subsidiaries, the “Company”) is a supplier of high performance modules and components for communications applications. The Company provides customers with standard and custom products as well as foundry services. The Company designs, develops and manufactures advanced high-performance radio frequency ("RF") solutions with products designed on various wafer substrates including gallium arsenide (“GaAs”), gallium nitride ("GaN") and piezoelectric crystals such as lithium tantalate (“LiTaO3”) and use a variety of high-performance process technologies including heterojunction bipolar transistor (“HBT”), pseudomorphic high electron mobility transistor (“pHEMT”), bipolar high electron mobility transistor ("BiHEMT"), metal-semiconductor field effect transistor ("MESFET"), copper flip ("CuFlip^TM"), wafer level packaging ("WLP"), surface acoustic wave (“SAW”), temperature compensated surface acoustic wave ("TC-SAW") and bulk acoustic wave (“BAW”). The Company’s primary end markets include mobile devices, networks and defense and aerospace systems. The Company’s customers include major communication companies worldwide.

The Company

12 Months Ended

Dec. 31, 2011

TriQuint Semiconductor, Inc. (collectively with its wholly owned subsidiaries, the “Company”) is a supplier of high performance modules and components for communications applications. The Company provides customers with standard and custom products as well as foundry services. The Company designs, develops and manufactures advanced high-performance radio frequency ("RF") solutions with products designed on various wafer substrates including gallium arsenide (“GaAs”), gallium nitride ("GaN") and piezoelectric crystals such as lithium tantalate (“LiTaO3”) and use a variety of high-performance process technologies including heterojunction bipolar transistor (“HBT”), pseudomorphic high electron mobility transistor (“pHEMT”), bipolar high electron mobility transistor ("BiHEMT"), metal-semiconductor field effect transistor ("MESFET"), copper flip ("CuFlip^TM"), wafer level packaging ("WLP"), surface acoustic wave (“SAW”), temperature compensated surface acoustic wave ("TC-SAW") and bulk acoustic wave (“BAW”). The Company’s primary end markets include mobile devices, networks and defense and aerospace systems. The Company’s customers include major communication companies worldwide.