EX-1.01 2 ex101-conflictmineralsrepo.htm EXHIBIT 1.01 EX. 1.01 - Conflict Minerals Report 12.31.14

Exhibit 1.01


QUALCOMM Incorporated
Conflict Minerals Report
Reporting Period: January 1, 2014 – December 31, 2014

Qualcomm Incorporated is a world leader in 3G, 4G and next-generation wireless technologies. Qualcomm Incorporated includes our licensing business and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our products and services businesses, including our semiconductor businesses and substantially all of our engineering, research and development functions. In this document, the words “we,” “our” and “us” refer only to Qualcomm Incorporated, Qualcomm Technologies, Inc. and/or their subsidiaries.
This Conflict Minerals Report (this Report) contains forward-looking statements regarding our business, products and conflict minerals efforts, including steps we intend to take to mitigate the risk that conflict minerals in our products benefit armed groups (identified as a perpetrator of serious human rights abuses) in the Democratic Republic of the Congo (DRC) or an adjoining country (a country that shares an internationally recognized border with the DRC). Words such as “expects,” “intends,” “believes,” “strives” and similar expressions or variations of such words are intended to identify forward-looking statements, but are not the exclusive means of identifying forward-looking statements in this Report. Additionally, statements concerning future matters that are not historical are forward-looking statements.
Although forward-looking statements in this Report reflect our good faith judgment, such statements can only be based on facts and factors currently known by us. Consequently, forward-looking statements are inherently subject to risks and uncertainties, and actual results and outcomes may differ materially from the results and outcomes discussed in or anticipated by the forward-looking statements. Factors that could cause or contribute to such differences in results and outcomes include without limitation: the risk that information reported to us by our suppliers from which we directly procure finished goods, components, materials and/or services for our products (direct suppliers), or industry information used by us, may be inaccurate; the risk that smelters or refiners (processing facilities) may not participate in the Conflict Free Smelter Program (CFSP), which is a voluntary initiative in which independent third parties audit processing facilities' procurement and processing activities and determine if the processing facilities maintain sufficient documentation to reasonably demonstrate conflict-free sourcing; as well as risks discussed under the heading “Risk Factors” in our most recent Quarterly Report on Form 10-Q related to our customer concentrations, our dependence on a limited number of third-party suppliers and our being subject to government regulations and policies. Readers are urged not to place undue reliance on forward-looking statements, which speak only as of the date of this Report. We undertake no obligation to revise or update any forward-looking statements in order to reflect any event or circumstance that may arise after the date of this Report. Throughout this Report, whenever a reference is made to our website, such reference does not incorporate information from the website by reference into this Report unless specifically identified as such.


Background
Pursuant to the Dodd-Frank Wall Street Reform and Consumer Protection Act (Dodd-Frank), the United States Securities and Exchange Commission (SEC) promulgated rules (the Final Rule) requiring certain companies with “conflict minerals” (columbite-tantalite (coltan), cassiterite, gold, wolframite, or their derivatives, which are limited to tantalum, tin and tungsten) that are necessary to the functionality or production of a product manufactured by or for that company to, among other things, disclose annually whether any of those conflict minerals originated in the

1



DRC or an adjoining country and if so, to submit a report to the SEC that includes a description of the measures it took to exercise due diligence on the conflict minerals’ source and chain of custody.
In anticipation of the Final Rule, the Electronics Industry Citizenship Coalition (EICC) and the Global e-Sustainability Initiative (GeSI) established an initiative that is known as the Conflict-Free Sourcing Initiative (CFSI). The EICC, GeSI and CFSI, which are comprised of numerous industry members, strive to promote the improvement of human welfare and the environment through responsible and proactive supply chain management.
We are a full member of the EICC, have adopted the EICC Code of Conduct and expect all of our direct suppliers to act in accordance with this Code. By employing EICC resources and working collaboratively with our peers, we are working to improve transparency and sustainability in the global electronics supply chain. We hold a leadership position on the Board of the EICC and actively participate in and support the CFSI’s responsible extractives initiatives.
We, along with many other companies, rely on the CFSI’s CFSP to verify processing facilities as not benefiting armed groups in the DRC or an adjoining country (CFSP-compliant). The CFSI also recognizes responsible sourcing practices of processing facilities that have been validated by the London Bullion Market Association (LBMA) and Responsible Jewellery Council (RJC).


Summary
We are a leading developer and supplier of integrated circuits based on CDMA (Code Division Multiple Access), OFDMA (Orthogonal Frequency Division Multiple Access) and other technologies for use in voice and data communications, networking, application processing, multimedia and global positioning system products. We manufacture or contract to manufacture products for which conflict minerals are necessary to the functionality or production of those products and which otherwise constitute products under the Final Rule. We primarily utilize a fabless production and assembly model, which means that we do not own or operate foundries or assemblers responsible for the production and assembly of our products.
In accordance with the Final Rule, we conducted in good faith a reasonable country of origin inquiry (RCOI) that was reasonably designed to determine whether any of the necessary conflict minerals in our products originated in the DRC or an adjoining country, or were from recycled or scrap sources. A description of our RCOI is set forth in this Report.
Based on our RCOI, we have reason to believe that some of the necessary conflict minerals used in our products originated in the DRC or an adjoining country (and may not have been from recycled or scrap sources). Accordingly, we exercised due diligence to determine the source and chain of custody of these conflict minerals. Our due diligence was designed to conform to an internationally recognized due diligence framework, specifically the Organisation for Economic Co-operation and Development (OECD) “Due Diligence Guidance for Responsible Supply Chains of Minerals from Conflict-Affected and High-Risk Areas (OECD Guidance)”, 2nd edition (2013). A description of our due diligence measures is also set forth in this Report.
Following the exercise of our due diligence, we have not identified any instances in which our sourcing of necessary conflict minerals directly or indirectly financed or benefitted armed groups in the DRC or an adjoining country. In addition, our integrated circuit products (described below) are comprised of tantalum sourced from 100% CFSP-compliant processing facilities.
The following descriptions are also provided within this Report:
The facilities used to process the necessary conflict minerals in our products, if known;

2



The country of origin of the necessary conflict minerals in our products, if known;
Our efforts to determine the mine or location of origin of the necessary conflict minerals in our products with the greatest possible specificity; and
The steps we have taken and the steps that we will take to mitigate the risk that our necessary conflict minerals benefit armed groups in the DRC or an adjoining country, including steps to improve our due diligence.


Product Description
I.
Integrated Circuit Products
Our integrated circuit products are sold to manufacturers that use our products in wireless devices, such as mobile phones, tablets, laptops, data modules, handheld wireless computers and gaming devices, access points and routers, data cards and infrastructure equipment, and in wired devices, particularly broadband gateway equipment, desktop computers and streaming media players. Our Mobile Station Modem (MSMTM) integrated circuits, which include the Mobile Data Modem, Qualcomm Single Chip and Qualcomm® SnapdragonTM processors and LTE modems, perform the core baseband modem functionality in wireless devices providing voice and data communications, as well as multimedia applications and global positioning functions. In addition, our Snapdragon processors provide advanced application and graphics processing capabilities. Because of our experience in designing and developing CDMA- and OFDMA-based products, we design both the baseband integrated circuits and the supporting system as well, including the RF (Radio Frequency), PM (Power Management) and connectivity devices. Our portfolio of RF products includes QFE (Qualcomm Front End) radio front end components.
Our wireless integrated circuit products are also sold to manufacturers that use our products for wireless local area network (WLAN), Bluetooth, frequency modulation (FM) and near field communications as well as technologies that enable location data and services and for implementation of small mobile base stations (known as small cells). Our networking products include Wi-Fi, Powerline and Ethernet integrated circuits and network processors.
Revenues from the sale of integrated circuit products comprised greater than 99% of the total revenues for our products described in this Report during the reporting period.
II.
Other Products
Our other products include air-to-ground modem cards, display modules, wireless medical devices and wearable devices.
Revenues from the sale of such other products comprised less than 1% of the total revenues for our products described in this Report during the reporting period.


Description of Supply Chain
We utilize a fabless production model, which means that we do not own or operate foundries for the production of silicon wafers from which our integrated circuits are made. Integrated circuits are die cut from silicon wafers that have completed the package assembly and test manufacturing processes. We employ both turnkey and two-stage manufacturing models to purchase our integrated circuits. Turnkey is when our foundry suppliers are responsible for delivering fully assembled and tested integrated circuits. Under the two-stage manufacturing model, we purchase wafers and die from integrated circuit manufacturing foundries and contract with separate third-party suppliers for manufacturing services such as wafer bump, probe, assembly and final test. We rely on our direct suppliers to

3



perform the manufacturing and assembly, and most of the testing, of our integrated circuits based primarily on our proprietary designs and test programs. Our direct suppliers and, in turn, their suppliers are responsible for the procurement of most of the materials used in the production of our integrated circuits. Certain materials purchased by our direct suppliers may come directly or indirectly from processing facilities that treat ores, concentrates, slags or secondary materials. Because we do not purchase any materials directly from these processing facilities, we must rely on certain information provided by our direct suppliers and the CFSI or other industry organizations in order to prepare this Report.
Our other products are primarily contracted to be manufactured as finished goods with the contract manufacturer responsible for the procurement of the materials and components that comprise these products.


Reasonable Country of Origin Inquiry
In accordance with the Final Rule, we conducted in good faith a reasonable country of origin inquiry (RCOI) that was reasonably designed to determine whether any of the necessary conflict minerals in our products originated in the DRC or an adjoining country or were from recycled or scrap sources.
Our conflict free minerals policy (available at:
https://www.qualcomm.com/#/company/sustainability/products/conflict-free-minerals) communicates the expectation that our direct suppliers obtain materials from environmentally and socially responsible sources, including conflict free sources within the DRC and adjoining countries. To conduct our RCOI and obtain sourcing information from our direct suppliers, we used the CFSI Conflict Minerals Reporting Template (CMRT) to collect information on the necessary conflict minerals in their supply chain. We requested this information from 100% of our direct suppliers that may use necessary conflict minerals in our products to determine whether any of these minerals originated in the DRC or an adjoining country or were from recycled or scrap sources. We received responses from 100% of the direct suppliers of our integrated circuit products and from 97% of the direct suppliers of our other products.
Our RCOI considered the countries of origin information obtained from our direct suppliers and the CFSI (members-only) data for CFSP-compliant processing facilities. Based on this information, we determined that approximately 6% of processing facilities reported by our direct suppliers were confirmed as sourcing conflict minerals from the DRC or an adjoining country. This represents an increase in processing facilities reported in our supply chain that source from the DRC or adjoining countries compared to calendar year 2013. Each of these processing facilities has been validated as CFSP-compliant.
Based on our direct suppliers’ responses to the RCOI, we have reason to believe that some of the necessary conflict minerals used in our products originated in the DRC or an adjoining country, but we have not identified any instances in which our sourcing of necessary conflict minerals directly or indirectly financed or benefitted armed groups in the DRC or an adjoining country.


Design of Due Diligence
Our due diligence measures have been designed to conform, in all material respects, to the framework provided by the OECD Guidance.



4





Description of Due Diligence Performed
OECD Step 1: Establish Strong Company Management Systems
We continued to publicly communicate our conflict minerals policy.
We maintained a conflict minerals management team with representation from our finance, government affairs, internal audit, legal, regulatory, quality and supply chain departments which reported on program activities to executive management and the Audit Committee of our Board of Directors on a regular basis.
We used the CMRT to identify processing facilities in our supply chain as reported by our direct suppliers.
We communicated our conflict minerals supplier requirements to our integrated circuit direct suppliers.
We maintained a public email address (conflictminerals@qti.qualcomm.com) available on our website for general inquiries and grievances regarding our conflict minerals program.
We designed and implemented a comprehensive conflict minerals data management tool that tracks end-to-end communication with direct suppliers, automates the validation of direct supplier data and consolidates CMRT responses for analysis and reporting.
OECD Step 2: Identify and Assess Risk in the Supply Chain
We used the CMRT to review our direct suppliers’ due diligence activities, such as whether they had a conflict minerals policy, required their own suppliers to source from processing facilities validated by an independent audit firm, and implemented a review process that includes corrective action management.
We used the CMRT to identify conflict minerals processing facilities if reported in our supply chain by direct suppliers.
We determined if the processing facilities adhere to responsible sourcing practices by cross-checking with the list of CFSP-compliant processing facilities.
We obtained countries of origin (when available) for CFSP-compliant processing facilities by relying on information provided by our direct suppliers, the CFSI and other public data sources.
OECD Step 3: Design and Implement a Strategy to Respond to Risk
We reported information on the source and chain of custody of conflict minerals in our supply chain to our conflict minerals working team and the Audit Committee of our Board of Directors on a regular basis.
We maintained a conflict minerals risk management plan that sets forth direct supplier-risk management strategies ranging from continued procurement to disengagement.
We participated in certain CFSP pre-audit site visits to processing facilities in Asia to encourage participation in the CFSP.
OECD Step 4: Third-Party Audit of Smelter/Refiner’s Due Diligence Practices
Because we do not source directly from processing facilities, we rely on the publicly-available results of the CFSP, LBMA and RJC third-party audits to validate the responsible sourcing practices of processing facilities in our supply chain.
The CFSI recognizes processing facilities as CFSP-compliant through validations conducted by the LBMA and RJC.

5



OECD Step 5: Report Annually on Supply Chain Due Diligence
We file a Form SD and Conflict Minerals Report with the SEC on an annual basis. Our Form SD and Conflict Minerals Report are also available on our website.
We periodically provide information regarding our conflict minerals program in the Qualcomm Sustainability Report, as well as on our Sustainability website.


Facilities Used to Process the Necessary Conflict Minerals in Our Products
We rely on the good faith efforts of our direct suppliers to provide us with reasonable representations of the processing facilities used to supply the necessary conflict minerals in our products.
At this time, the processing facilities that we list in Tables 1, 2 and 3 are those that have been determined to be legitimate processing facilities by the CFSI. All processing facilities used in our semiconductor businesses are included in these tables. The direct suppliers of certain of our other products reported other processing facilities as being in our supply chain that are not listed in these tables as the CFSI has not yet determined them to be legitimate. In these tables, we have also indicated the headquarter locations of known processing facilities and whether such facilities have been validated as CFSP-compliant.
Some of our direct supplier responses represented their supply chain at a company-level rather than being product-specific. As such, the list of processing facilities that we have disclosed in this Report may contain more facilities than those that actually process the conflict minerals contained in our products.


Country of Origin of the Necessary Conflict Minerals in Our Products
We requested country of origin information (if known) from each of our direct suppliers, most of which do not source directly from processing facilities, for the purposes of determining the source and chain of custody of the necessary conflict minerals in our supply chain. We also relied on the country of origin information provided by the CFSI (when available) for CFSP-compliant processing facilities.
Based on country of origin information provided by our direct suppliers and the CFSP, we have reason to believe that some of our necessary conflict minerals originated from the DRC and one or more adjoining country, but we have not identified any instances in which our sourcing of necessary conflict minerals directly or indirectly financed or benefitted armed groups in the DRC or an adjoining country.


Our Efforts to Determine the Mine or Location of Origin of the Necessary Conflict Minerals in Our Products
We requested mine or location of origin information of the necessary conflict minerals contained in products from each of our direct suppliers using the CMRT. In some instances our direct suppliers reported name or location of mine (country). However, many of our direct suppliers were unable to obtain reliable mine or location of origin data for their necessary conflict minerals.


Steps We Have Taken to Mitigate the Risk that our Necessary Conflict Minerals Benefit Armed Groups

6



From calendar year 2013 to 2014, we noted CFSP-compliant processing facilities used in our integrated circuits products increased by 38% (Figure 1).
Figure 1. Integrated circuits processing facilities status by year


Figure 1 Notes
CFSP-compliant: Processing facilities reported in our supply chain that were validated as compliant according to the CFSP.
CFSP-participating: Processing facilities reported in our supply chain that have agreed to participate in the CFSP but have not yet completed the program.
CFSP-non-participating: Processing facilities reported in our supply chain that have yet to agree to participate in the CFSP.











7





From calendar year 2013 to 2014, we noted a 175% increase in our integrated circuit direct suppliers that used 100% CFSP-compliant processing facilities (Figure 2).
Figure 2. Integrated circuits direct suppliers that used 100% CFSP-compliant processing facilities by year



Steps We Will Take to Mitigate the Risk that our Necessary Conflict Minerals Benefit Armed Groups
During calendar year 2015, we intend to advance the effectiveness of our due diligence efforts to mitigate the risk that our necessary conflict minerals benefit armed groups in the DRC or an adjoining country by:
1.
Continuing to engage with direct suppliers, processing facilities and the CFSI to encourage non-CFSP validated processing facilities to become validated as CFSP-compliant;
2.
Striving to use only CFSP-compliant direct suppliers for our integrated circuit products; and
3.
Continuing to participate in the following industry coalitions and non-governmental organizations’ efforts to support the responsible sourcing of minerals: EICC, CFSI, International Tin Research Initiative, Public-Private Alliance for Responsible Minerals Trade and the Responsible Sourcing Network multi-stakeholder group.





8







Tables of Conflict Minerals Processing Facilities
Table 1. CFSP-compliant processing facilities as of January 31, 2015
Processing facilities and their locations reported in our supply chain that were validated as compliant according to the CFSP.
Metal
Processing Facility Name
Country
Gold
Allgemeine Gold-und Silberscheideanstalt A.G.
GERMANY
Gold
AngloGold Ashanti Córrego do Sítio Mineraçäo
BRAZIL
Gold
Argor-Heraeus SA
SWITZERLAND
Gold
Asahi Pretec Corporation
JAPAN
Gold
Aurubis AG
GERMANY
Gold
Boliden AB
SWEDEN
Gold
CCR Refinery - Glencore Canada Corporation
CANADA
Gold
Chimet S.p.A.
ITALY
Gold
Dowa
JAPAN
Gold
Eco-System Recycling Co., Ltd.
JAPAN
Gold
Heimerle + Meule GmbH
GERMANY
Gold
Heraeus Ltd. Hong Kong
HONG KONG
Gold
Heraeus Precious Metals GmbH & Co. KG
GERMANY
Gold
Ishifuku Metal Industry Co., Ltd.
JAPAN
Gold
Istanbul Gold Refinery
TURKEY
Gold
Japan Mint
JAPAN
Gold
Johnson Matthey Inc
UNITED STATES
Gold
Johnson Matthey Ltd
CANADA
Gold
JX Nippon Mining & Metals Co., Ltd.
JAPAN
Gold
Kazzinc Ltd
KAZAKHSTAN
Gold
Kennecott Utah Copper LLC
UNITED STATES
Gold
Kojima Chemicals Co., Ltd
JAPAN
Gold
LS-NIKKO Copper Inc.
KOREA, REPUBLIC OF
Gold
Materion
UNITED STATES
Gold
Matsuda Sangyo Co., Ltd.
JAPAN
Gold
Metalor Technologies (Hong Kong) Ltd
HONG KONG
Gold
Metalor Technologies (Singapore) Pte. Ltd.
SINGAPORE

9



Gold
Metalor Technologies SA
SWITZERLAND
Gold
Metalor USA Refining Corporation
UNITED STATES
Gold
Met-Mex Peñoles, S.A.
MEXICO
Gold
Mitsubishi Materials Corporation
JAPAN
Gold
Mitsui Mining and Smelting Co., Ltd.
JAPAN
Gold
Nadir Metal Rafineri San. Ve Tic. A.Ş.
TURKEY
Gold
Nihon Material Co. LTD
JAPAN
Gold
Ohio Precious Metals, LLC
UNITED STATES
Gold
Ohura Precious Metal Industry Co., Ltd
JAPAN
Gold
OJSC Krastvetmet
RUSSIAN FEDERATION
Gold
PAMP SA
SWITZERLAND
Gold
PX Précinox SA
SWITZERLAND
Gold
Rand Refinery (Pty) Ltd
SOUTH AFRICA
Gold
Royal Canadian Mint
CANADA
Gold
Schöne Edelmetaal B.V.
NETHERLANDS
Gold
SEMPSA Joyería Platería SA
SPAIN
Gold
Solar Applied Materials Technology Corp.
TAIWAN
Gold
Sumitomo Metal Mining Co., Ltd.
JAPAN
Gold
Tanaka Kikinzoku Kogyo K.K.
JAPAN
Gold
Tokuriki Honten Co., Ltd
JAPAN
Gold
Umicore Brasil Ltda
BRAZIL
Gold
Umicore Precious Metals Thailand
THAILAND
Gold
Umicore SA Business Unit Precious Metals Refining
BELGIUM
Gold
United Precious Metal Refining, Inc.
UNITED STATES
Gold
Valcambi SA
SWITZERLAND
Gold
Western Australian Mint trading as The Perth Mint
AUSTRALIA
Tantalum
Changsha South Tantalum Niobium Co., Ltd.
CHINA
Tantalum
Conghua Tantalum and Niobium Smeltry
CHINA
Tantalum
Duoluoshan
CHINA
Tantalum
Exotech Inc.
UNITED STATES
Tantalum
F&X Electro-Materials Ltd.
CHINA
Tantalum
Global Advanced Metals Aizu
JAPAN
Tantalum
Global Advanced Metals Boyertown
UNITED STATES
Tantalum
Global Advanced Metals^
UNITED STATES
Tantalum
Guangdong Zhiyuan New Material Co., Ltd.
CHINA

10



Tantalum
H.C. Starck Co., Ltd.
THAILAND
Tantalum
H.C. Starck GmbH Goslar
GERMANY
Tantalum
H.C. Starck GmbH Laufenburg
GERMANY
Tantalum
H.C. Starck Group^
GERMANY
Tantalum
H.C. Starck Hermsdorf GmbH
GERMANY
Tantalum
H.C. Starck Inc.
UNITED STATES
Tantalum
H.C. Starck Ltd.
JAPAN
Tantalum
H.C. Starck Smelting GmbH & Co.KG
GERMANY
Tantalum
Hengyang King Xing Lifeng New Materials Co., Ltd.
CHINA
Tantalum
Hi-Temp
UNITED STATES
Tantalum
JiuJiang JinXin Nonferrous Metals Co., Ltd.
CHINA
Tantalum
Jiujiang Tanbre Co., Ltd.
CHINA
Tantalum
KEMET Blue Metals
MEXICO
Tantalum
KEMET Blue Powder^
UNITED STATES
Tantalum
LSM Brasil S.A.
BRAZIL
Tantalum
Metallurgical Products India (Pvt.) Ltd.
INDIA
Tantalum
Mineração Taboca S.A.
BRAZIL
Tantalum
Mitsui Mining & Smelting
JAPAN
Tantalum
Molycorp Silmet A.S.
ESTONIA
Tantalum
Ningxia Orient Tantalum Industry Co., Ltd.
CHINA
Tantalum
Plansee SE Liezen
AUSTRIA
Tantalum
Plansee SE Reutte
AUSTRIA
Tantalum
Plansee^
AUSTRIA
Tantalum
QuantumClean
UNITED STATES
Tantalum
RFH Tantalum Smeltry Co., Ltd
CHINA
Tantalum
Solikamsk Magnesium Works OAO
RUSSIAN FEDERATION
Tantalum
Taki Chemical
JAPAN
Tantalum
Tantalite Resources#
SOUTH AFRICA
Tantalum
Telex
UNITED STATES
Tantalum
Ulba
KAZAKHSTAN
Tantalum
Zhuzhou Cement Carbide
CHINA
Tin
Alpha
UNITED STATES
Tin
CV United Smelting
INDONESIA
Tin
Gejiu Non-Ferrous Metal Processing Co. Ltd.
CHINA
Tin
Magnu's Minerais Metais e Ligas LTDA
BRAZIL

11



Tin
Malaysia Smelting Corporation (MSC)
MALAYSIA
Tin
Melt Metais e Ligas S/A
BRAZIL
Tin
Mineração Taboca S.A.
BRAZIL
Tin
Minsur
PERU
Tin
Mitsubishi Materials Corporation
JAPAN
Tin
OMSA
BOLIVIA
Tin
PT Babel Inti Perkasa
INDONESIA
Tin
PT Bangka Putra Karya
INDONESIA
Tin
PT Bangka Tin Industry
INDONESIA
Tin
PT Bukit Timah
INDONESIA
Tin
PT DS Jaya Abadi
INDONESIA
Tin
PT REFINED BANGKA TIN
INDONESIA
Tin
PT Sariwiguna Binasentosa
INDONESIA
Tin
PT Stanindo Inti Perkasa
INDONESIA
Tin
PT Tambang Timah
INDONESIA
Tin
PT Timah (Persero), Tbk
INDONESIA
Tin
Thaisarco
THAILAND
Tin
White Solder Metalurgia e Mineração Ltda.
BRAZIL
Tin
Yunnan Tin Company, Ltd.
CHINA
Tungsten
Ganzhou Huaxing Tungsten Products Co., Ltd.
CHINA
Tungsten
Ganzhou Jiangwu Ferrotungsten Co., Ltd.
CHINA
Tungsten
Ganzhou Seadragon W & Mo Co., Ltd.
CHINA
Tungsten
Global Tungsten & Powders Corp.
UNITED STATES
Tungsten
Hunan Chunchang Nonferrous Metals Co., Ltd.
CHINA
Tungsten
Japan New Metals Co., Ltd.
JAPAN
Tungsten
Malipo Haiyu Tungsten Co., Ltd.
CHINA
Tungsten
Xiamen Tungsten (H.C.) Co., Ltd.
CHINA
Tungsten
Xiamen Tungsten Co., Ltd.
CHINA

Table 1 Notes
Processing facilities followed by a pound (#) symbol ceased operation during calendar year 2014.
Processing facilities followed by a caret (^) symbol had previously been identified at a “corporate” or “group” level whereby one entry may have represented multiple individual facilities. With CMRT Revision 3.02, these higher level entities have been eliminated and replaced with entries representing each unique facility.

Table 2. CFSP-participating processing facilities as of January 31, 2015

12



Processing facilities and their locations reported in our supply chain that have agreed to participate in the CFSP but have not yet completed the program.
Metal
Processing Facility Name
Country
Gold
Aida Chemical Industries Co. Ltd.
JAPAN
Gold
Asaka Riken Co Ltd
JAPAN
Gold
C. Hafner GmbH + Co. KG
GERMANY
Gold
Cendres + Métaux SA
SWITZERLAND
Gold
Sabin Metal Corp.
UNITED STATES
Gold
Shandong Zhaojin Gold & Silver Refinery Co. Ltd
CHINA
Gold
SOE Shyolkovsky Factory of Secondary Precious Metals
RUSSIAN FEDERATION
Gold
Yamamoto Precious Metal Co., Ltd.
JAPAN
Gold
Yokohama Metal Co Ltd
JAPAN
Tantalum
King-Tan Tantalum Industry Ltd
CHINA
Tin
China Tin Group Co., Ltd.
CHINA
Tin
Cooper Santa
BRAZIL
Tin
CV Nurjanah
INDONESIA
Tin
CV Serumpun Sebalai
INDONESIA
Tin
EM Vinto
BOLIVIA
Tin
Fenix Metals
POLAND
Tin
Metallo Chimique
BELGIUM
Tin
PT Artha Cipta Langgeng
INDONESIA
Tin
PT Bangka Kudai Tin
INDONESIA
Tin
PT Bangka Timah Utama Sejahtera
INDONESIA
Tin
PT Belitung Industri Sejahtera
INDONESIA
Tin
PT BilliTin Makmur Lestari
INDONESIA
Tin
PT Eunindo Usaha Mandiri
INDONESIA
Tin
PT Inti Stania Prima
INDONESIA
Tin
PT Karimun Mining
INDONESIA
Tin
PT Mitra Stania Prima
INDONESIA
Tin
PT Pelat Timah Nusantara Tbk
INDONESIA
Tin
PT Prima Timah Utama
INDONESIA
Tin
PT Sumber Jaya Indah
INDONESIA
Tin
PT Tinindo Inter Nusa
INDONESIA
Tin
Rui Da Hung
TAIWAN
Tin
Soft Metais, Ltda.
BRAZIL

13



Tin
Yunnan Chengfeng Non-ferrous Metals Co.,Ltd.
CHINA
Tungsten
Chongyi Zhangyuan Tungsten Co., Ltd.
CHINA
Tungsten
Fujian Jinxin Tungsten Co., Ltd.*
CHINA
Tungsten
Ganzhou Non-ferrous Metals Smelting Co., Ltd.
CHINA
Tungsten
Guangdong Xianglu Tungsten Industry Co., Ltd.
CHINA
Tungsten
Vietnam Youngsun Tungsten Industry Co., Ltd*
VIETNAM
Tungsten
Wolfram Bergbau und Hütten AG
AUSTRIA
Tungsten
Xinhai Rendan Shaoguan Tungsten Co., Ltd.
CHINA

Table 2 Notes
Smelters followed by an asterisk (*) symbol are Tungsten Industry - Conflict Minerals Council (TI-CMC) members that have committed to complete a CFSP validation audit within two (2) years of TI-CMC membership issuance.

Table 3. CFSP-non-participating processing facilities as of January 31, 2015
Processing facilities and their locations reported in our supply chain that have not agreed to participate in the CFSP.
Metal
Processing Facility Name
Country
Gold
Almalyk Mining and Metallurgical Complex (AMMC)
UZBEKISTAN
Gold
Atasay Kuyumculuk Sanayi Ve Ticaret A.S.
TURKEY
Gold
Bangko Sentral ng Pilipinas (Central Bank of the Philippines)
PHILIPPINES
Gold
Bauer Walser AG
GERMANY
Gold
Caridad
MEXICO
Gold
Chugai Mining
JAPAN
Gold
Colt Refining
UNITED STATES
Gold
Daejin Indus Co. Ltd
KOREA, REPUBLIC OF
Gold
DaeryongENC
KOREA, REPUBLIC OF
Gold
Daye Non-Ferrous Metals Mining Ltd.
CHINA
Gold
Do Sung Corporation
KOREA, REPUBLIC OF
Gold
Doduco
GERMANY
Gold
FSE Novosibirsk Refinery
RUSSIAN FEDERATION
Gold
Gansu Seemine Material Hi-Tech Co Ltd
CHINA
Gold
Guangdong Jinding Gold Limited
CHINA
Gold
Hunan Chenzhou Mining Group Co., Ltd.
CHINA
Gold
Hwasung CJ Co. Ltd
KOREA, REPUBLIC OF

14



Gold
Inner Mongolia Qiankun Gold and Silver Refinery Share Company Limited
CHINA
Gold
Jiangxi Copper Company Limited
CHINA
Gold
JSC Ekaterinburg Non-Ferrous Metal Processing Plant
RUSSIAN FEDERATION
Gold
JSC Uralelectromed
RUSSIAN FEDERATION
Gold
Korea Metal Co. Ltd
KOREA, REPUBLIC OF
Gold
Kyrgyzaltyn JSC
KYRGYZSTAN
Gold
L' azurde Company For Jewelry
SAUDI ARABIA
Gold
Lingbao Gold Company Limited
CHINA
Gold
Lingbao Jinyuan Tonghui Refinery Co. Ltd.
CHINA
Gold
Luoyang Zijin Yinhui Metal Smelt Co Ltd
CHINA
Gold
Moscow Special Alloys Processing Plant
RUSSIAN FEDERATION
Gold
Navoi Mining and Metallurgical Combinat
UZBEKISTAN
Gold
OJSC Kolyma Refinery
RUSSIAN FEDERATION
Gold
Prioksky Plant of Non-Ferrous Metals
RUSSIAN FEDERATION
Gold
PT Aneka Tambang (Persero) Tbk
INDONESIA
Gold
Samwon Metals Corp.
KOREA, REPUBLIC OF
Gold
So Accurate Group, Inc.
UNITED STATES
Gold
The Great Wall Gold and Silver Refinery of China
CHINA
Gold
The Refinery of Shandong Gold Mining Co. Ltd
CHINA
Gold
Tongling nonferrous Metals Group Co., Ltd
CHINA
Gold
Torecom
KOREA, REPUBLIC OF
Gold
Yunnan Copper Industry Co Ltd
CHINA
Gold
Zhongyuan Gold Smelter of Zhongjin Gold Corporation
CHINA
Gold
Zijin Mining Group Co. Ltd
CHINA
Tantalum
Shanghai Jiangxi Metals Co. Ltd
CHINA
Tin
CNMC (Guangxi) PGMA Co. Ltd.
CHINA
Tin
CV JusTindo
INDONESIA
Tin
CV Makmur Jaya
INDONESIA
Tin
Estanho de Rondônia S.A.
BRAZIL
Tin
Gejiu Kai Meng Industry and Trade LLC
CHINA
Tin
Gejiu Zi-Li
CHINA
Tin
Huichang Jinshunda Tin Co. Ltd
CHINA
Tin
Jiangxi Nanshan
CHINA

15



Tin
Linwu Xianggui Smelter Co
CHINA
Tin
Minmetals Ganzhou Tin Co. Ltd.^
CHINA
Tin
Novosibirsk Integrated Tin Works
RUSSIAN FEDERATION
Tin
O.M. Manufacturing (Thailand) Co., Ltd.
THAILAND
Tin
PT Alam Lestari Kencana
INDONESIA
Tin
PT Babel Surya Alam Lestari
INDONESIA
Tin
PT Fang Di MulTindo
INDONESIA
Tin
PT HP Metals Indonesia
INDONESIA
Tin
PT Koba Tin
INDONESIA
Tin
PT Yinchendo Mining Industry
INDONESIA
Tungsten
A.L.M.T. Corp.*
JAPAN
Tungsten
Chenzhou Diamond Tungsten Products Co., Ltd.*
CHINA
Tungsten
Dayu Weiliang Tungsten Co., Ltd.*
CHINA
Tungsten
H.C. Starck GmbH*
GERMANY
Tungsten
H.C. Starck Smelting GmbH & Co.KG*
GERMANY
Tungsten
HC Starck GmbH*^
GERMANY
Tungsten
Hunan Chenzhou Mining Group Co*
CHINA
Tungsten
Jiangxi Gan Bei Tungsten Co., Ltd.*
CHINA
Tungsten
Jiangxi Minmetals Gao'an Non-ferrous Metals Co., Ltd.
CHINA
Tungsten
Jiangxi Tonggu Non-ferrous Metallurgical & Chemical Co., Ltd.*
CHINA
Tungsten
Jiangxi Xinsheng Tungsten Industry Co., Ltd.*
CHINA
Tungsten
Kennametal Fallon*
UNITED STATES
Tungsten
Kennametal Huntsville*
UNITED STATES
Tungsten
Tejing (Vietnam) Tungsten Co., Ltd.*
VIETNAM
Tungsten
Wolfram Company CJSC*
RUSSIAN FEDERATION
Tungsten
Zhuzhou Cemented Carbide Group Co Ltd^
CHINA

Table 3 Notes
Processing facilities followed by a caret (^) symbol had previously been identified at a “corporate” or “group” level whereby one entry may have represented multiple individual facilities. With CMRT Revision 3.02, these higher level entities have been eliminated and replaced with entries representing each unique facility.
Processing facilities followed by an asterisk (*) symbol are Tungsten Industry - Conflict Minerals Council (TI-CMC) members that have committed to complete a CFSP validation audit within two (2) years of TI-CMC membership issuance.

16