Exhibit 99.2

PRISMARK PRESENTATION

P

REPARED

F

OR

:

ORBOTECH

INVESTOR AND ANALYST DAY

June 2010

PCB MARKETS AND TECHNOLOGY

P

REPARED

BY

:

PRISMARK PARTNERS LLC

130 Main Street Cold Spring Harbor NY 11724

Tel: 631 367-9187 Fax: 631 367-9223

e-mail: partners@prismark.com

www.prismark.com

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A Brief Talk On Printed Circuit Board Markets and

Technology

•

Electronic Systems Applications

•

Diversity of Needs

•

Growth Coming From New and Old

•

Aspects of Regional Production

•

Challenging Technology

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5.0%

4.0%

3.0%

2.0%

1.0%

4.5%

3.5%

2.5%

1.5%

0.5%

0%

Year-on-Year

GDP Growth

0%

10%

20%

30%

40%

50%

Year-on-Year

Semiconductor

Growth

Year-on-Year

World Rigid

PCB Growth

-10%

-20%

-30%

-40%

-50%

1989

1990

1991

1992

1993

1994

1995

1996

1997

1998

1999

2000

2001

2002

2003

2004

2005

2006

2007

2009

2011

2012

2013

2014

2010

2008

1.4%

-3.5%

-6.8%

1.4%

14.2%

-20.1%

-5.7%

8.0%

15.3%

5.8%

11.1%

5.6%

-14.9%12.5%

7.3%

0.8%

2.1%

4.1%

1.1%

12.5%

9.2%

3.7%

9.5%

12.0%

16.0%

11.5%

Printed

Circuit

Value

Growth

-25%

-20%

-15%

-10%

-5%

0%

5%

10%

15%

20%

$ Value of

Semiconductor Shipments

Year-on-Year Change

Printed Circuit

Value Growth

WORLD PRINTED CIRCUIT FORECAST

Kc510239bp-forecast pcb-gdp

GDP of Top 20

Electronics Nations

Year-on-Year Change

YE 2008    -1.5%

Q1 2009    -2.7%

Q2 2009    -2.1%

GDP Rate of Change

ELECTRONICS SYSTEMS MARKET FORECAST

($Bn)

2009

2010

2014

2010/2009

CAAGR

2009 – 2014

PC

$210

$226

$256

7.6%

4.0%

Server/Data Storage

$93

$98

$113

5.4%

4.0%

Other Computer

$93

$98

$112

5.4%

3.8%

Mobile Phones

$146

$158

$182

8.2%

4.5%

Communications Infrastructure

$116

$122

$150

5.2%

5.3%

Other Communications

$41

$43

$52

4.9%

4.9%

Consumer

$152

$163

$200

7.2%

5.6%

Automotive

$105

$120

$150

14.3%

7.4%

Industrial 

$91

$99

$147

8.8%

10.0%

PV Modules

$22

$29

$50

31.8%

17.8%

Medical

$77

$82

$100

6.5%

5.4%

Military/Aerospace

$118

$121

$145

2.5%

4.2%

Total (Including PV Modules)

$1,264

$1,359

$1,657

7.5%

5.6%

310.239jd

HIGH VOLUME SYSTEM SHIPMENTS

(M Units)

2008

2009 

2014 (F)

CAAGR

(2009 – 2014)

Mobile Handsets (Smartphone)

1,200 (150)

1,145 (175)

1,600 (550)

6.9% (26%)

MP3/PMP Players (Video Capable)

215 (35)

210 (40)

250 (80)

3.5% (15%)

Notebook PCs (Netbook, UMPC,

Smartbook, Tablet)

142 (12)

170 (33)

330 (120)

14% (29%)

Desktop PCs (PC Server)

150 (8)

133 (7)

130 (10)

-0.5% (5.6%)

Digital Cameras

135

130

165

4.9%

Camcorders

19

20

21

1%

Set-Top Box/PVR

140

170

220

5.5%

Flat Panel TVs

114

145

240

10.6%

LCD Monitors

172

140

150

1.4%

Portable GPS

40

35

55

9.5%

Game Consoles

50

53

65

4.2%

Portable Game Consoles

45

50

60

3.7%

Note: Values in parentheses are subsets of total

310.9/239bp

ASIA -THE PRODUCTION BASE

AND GROWTH ENGINE OF THE PCB INDUSTRY

510.3.044kk

May 2010

2000

2001

2004

2007

2010

2002

2005

2008

2011

2003

2006

2009

2012

2013

2014

May 2010

$5

$0

$10

$15

$20

$25

$30

$35

$40

$45

$50

$55

$65

$60

$70

$Bn

Historical Growth Rate

From 1995 to 2000

10.7% per year

Greater than six-year

global recovery period

Americas

Europe

Japan

$40.9Bn

$40.6Bn

Growth Drivers: Microvia,

Flex, Packaging Substrates

PCB Production in China

Still Grows Strongly

RECENT HISTORY AND OUTLOOK FOR THE

GLOBAL PRINTED CIRCUIT INDUSTRY

$41.1Bn

China

Asia

(ex. Japan and China)

RECENT HISTORY AND OUTLOOK FOR THE

GLOBAL PRINTED CIRCUIT INDUSTRY

-5.2%

-14.7%

-18.8%

-36.6%

-23.5%

Three year recovery period

driven by emerging

economies

Average Growth Rate

Forecast

From 2009 to 2014

5.3% per year

8.4% $3.4Bn

6.2%

$3.3Bn

20.2% $8.3Bn

15.0%

$7.9Bn

31.8% $13.1Bn

33.0%

$17.5Bn

34.7% $14.3Bn

41.9%

$22.2Bn

$53.0Bn

4.0%

$2.1Bn

5.0% $2.0Bn

510.3/044kk

CHANGES AND FORECAST OF THE PCB MARKET

Value ($M)

2000

2009

Change

2000 – 2009

2014

2009 - 2014

CAAGR

Commodity Boards

$9,674 

$6,336 

-34.5%

$7,216 

2.6%

Multilayer Boards

$22,217 

$16,763 

-24.5%

$22,017 

5.6%

Microvia Boards

$2,074 

$5,456 

163.1%

$7,090 

5.4%

Packaging Substrates

$3,505 

$5,891 

68.1%

$7,963 

6.2%

Flexible Circuits

$3,450 

$6,606 

91.5%

$8,746 

5.8%

Total

$40,920 

$41,052 

0.3%

$53,032 

5.3%

2000

Total:

$40,920M

Total:

$41,052M

Total:

$53,032M

2009

2014

Commodity Boards

23.6%

Multilayer

Boards

54.3%

Multilayer

Boards

40.8%

Multilayer

Boards

41.5%

Microvia

Boards

5.1%

Microvia

Boards

13.3%

Microvia

Boards

13.4%

Packaging

Substrates

8.6%

Packaging

Substrates

14.3%

Packaging

Substrates

15.0%

Flexible Circuits

8.4%

Flexible

Circuits

16.1%

Flexible Circuits

16.5%

Commodity Boards

15.4%

Commodity Boards

13.6%

N510.044skc-changes pies

510.3/023bp

APPLE iPAD MAIN PCB

1-8-1 microvia construction

All layers glass reinforced

790µm thick, 630µm core

220µm PTH, 90µm microvias

75µm L/S

Copper thickness range from 25-35µm

Supports multiple 0.5mm pitch

components up to 533 I/O

Photos source: Prismark/Binghamton University

97.3/039jm

LG CYON MOBILE PHONE

TECHNOLOGY DEVELOPMENT OF ADVANCED

MULTILAYER AND RIGID FLEX CIRCUITS

2008

2010

2012-2014

Structure

Multilayer or Rigid-Flex

Material

PI Film and FR-4 Prepreg

Z-axis Interconnection

PTH, Staggered and Stacked Via

Maximum Layer Count 

20 (4-8 typical)

20 (4 to 10 typical)

30 (4 to 12 typical)

Flexible Air-gap Layer

4-6

Build-up Layers (each side)

2

3

3

Minimum Board Thickness (mm)

0.35

0.30

0.25

Outer layer Cu Thickness (µm)

25

20

20

Outer layer Cu Line/Space (µm)

55/55

50/50

45/45

Inner Layer Cu Thickness (µm)

12

12

9

Inner Layer Cu Line/Space (µm)

50/50

45/45

35/35

PTH Diameter/Capture Pad (µm)

200/450

180'350

150/300

Blind Via/Capture Pad (µm)

80/225

75/200

75/150

Soldermask Thickness (µm)

15

15

13

Soldermask Clearance (µm)

35

30

25

Nippon Mektron

Multilayer FPC

CMK 8 layer RF-3-DB Stacked Via

79.3/039skc

NOKIA 1616 DUAL-BAND GSM MOBILE PHONE

•

Based on Infineon Device and Design

1.

Infineon baseband/RF/PM and FM

2.

Samsung memory

3.

Transmit module

•

Four-Layer PCB

–

Single-sided assembly

–

Keypad LED mounted on back through hole

–

Carbon ink button and ground contacts, jumpers

–

LCD module flex tail hot bar soldered to front

•

Low-End GSM-Only Mobile Phone

–

900/1800MHz (850/1900MHz version also available)

–

GSM only, no GPRS

–

107 x 45 x 15mm, 79grams

–

65k color TFT display, 128 x 160 pixels

–

Flashlight, FM radio

–

Series 30 OS

–

800mAhr Battery: 8.5hr talk, 528 standby time

•

Nokia 1616

–

4 x 10.5cm, 770µm thick

–

150µm glass reinforced outer layers

–

75µm L/S, 280µm PTH

–

Supports two packages of 0.5mm pitch 

(184 and 44 I/O)

6510.4/062jpp

1

2

3

Photos source: Prismark/Binghamton University

GLOBAL PCB PRODUCTION BY TECHNOLOGY

Area

Paper

29.3%  71.1M m

2

Paper

25.1%  81.8M m

2

Flexible Circuits

10.0%  24.2M m

2

Flexible Circuits

11.0%  36.0M m

2

Rigid Glass

16.5%  40.0M m

2

Rigid Glass

17.4%  55.6M m

2

4 Layer

19.3%  46.9M m

2

4 Layer

20.1%  65.4M m

2

6 Layer

6.9%  16.8M m

2

6 Layer

7.9%  25.7M m

2

8-16 Layer

3.6%  8.7M m

2

8-16 Layer

4.8%  15.6M m

2

18+ Layer

0.2%  0.4M m

2

18+ Layer

0.2%  0.5M m

2

Silicon Platforms

2.0%  4.8M m

2

Silicon Platforms

2.4%  7.9M m

2

Microvia

4.2%  10.3M m

2

Microvia

4.8%  15.6M m

2

2014

2009

TOTAL: 242.6M m

TOTAL: 326.0M m

CAAGR 6.1%

Composite

8.0%  19.4M m

Composite

6.4%  20.8M m

June 2010

Paper

Composite

Rigid

4 Layers

6 Layers

8 to 16 Layers

18+ Layers

Microvia

Si Platform

Flex

Total

2.8%

1.4%

7.2%

6.9%

8.9%

12.3%

6.1%

8.7%

10.7%

8.2%

6.1%

Technology

CAAGR

2009-2014

2

2

2

2