Subsequent Event (Notes)

9 Months Ended

Mar. 26, 2016

Subsequent Events [Abstract]

Subsequent Events [Text Block]

SUBSEQUENT EVENT

On April 7, 2016, the Company entered into an agreement for the sale of its Dallas, Texas campus, including its wafer level packaging manufacturing facility, for approximately $34.5 million. The Company expects to close the transaction during the fourth quarter of fiscal year 2016, subject to the satisfaction of customary closing conditions. In connection with this sale agreement, the Company will enter into a lease and facility sharing agreement to lease back portions of the Dallas, Texas campus as of the closing of the transaction as it completes the transition of design, administration and manufacturing activities during fiscal year 2016 and 2017.

On April 13, 2016, the Company entered into agreements for the sale of its micro-electromechanical systems (MEMS) business line. The Company currently expects to close the transaction and record the resulting gain on sale during the fourth quarter of fiscal year 2016, subject to the satisfaction of certain closing conditions; however, there is no guarantee that this transaction will close timely, or at all.