Exhibit 99.1


NEWS RELEASE


FOR IMMEDIATE RELEASE
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CONTACT:   Mason N. Carter, Chairman & CEO
           973-575-1300, ext. 1202
           mnc@merrimacind.com
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          MERRIMAC'S MULTI-MIX(R) MICROTECHNOLOGY GRANTED PATENT BY THE
                           PEOPLE'S REPUBLIC OF CHINA

WEST CALDWELL, N.J. MARCH 31, 2006: Merrimac Industries, Inc. (AMEX: MRM), today
announced that it has been granted a patent for its Multi-Mix(R) Microtechnology
from the State Intellectual Property Office of the People's Republic of China
entitled "Method of Making Microwave Multifunction Modules Using Fluoropolymer
Composite Substrates".

Chairman and CEO Mason N. Carter commented, "This patent further supports our
Multi-Mix(R) Product/Market Strategy and enhances our intellectual property in
one of the key growth areas in the global economy and facilitates our ability to
secure manufacturing and licensing arrangements in China. This patent covers
products such as low cost integrated power amplifiers and radio transceivers for
wireless infrastructure and WiMAX base stations in the 450 MHz - 3.7 GHz range
as well as Microwave and Millimeterwave line of sight (LOS) digital radios and
backhaul systems."

Mr. Carter continued, "There is growing trend in the wireless infrastructure
industry to integrate base station power amplifiers and radio transceivers. This
trend is in line with our Multi-Mix(R) high power integrated platform strategy
to replace labor intensive and expensive discrete RF subsystems such as power
amplifiers, radio transceivers, tower mount antennas (TMAs), with low cost,
compact, and light weight integrated solutions. This patent enhances Merrimac's
position as a pioneer in the global wireless infrastructure industry offering
the industry's first integrated radio transceivers, power amplifiers and
transmit and receive (T/R) modules for base station and tower top applications.
This patent enhances our competitive position to establish significant
partnerships with major base station OEMs in China enabling Merrimac to
participate with its advanced integrated high power amplifier technology in a
growing number of base station opportunities.

Mr. Carter further noted, "Multi-Mix(R) Microtechnology is an innovative
proprietary enabling platform technology developed exclusively for integration
of RF, Microwave and Millimeterwave circuits, multifunction modules and
subsystems where high RF power handing capability and superior thermal
management are performance critical. Multi-Mix(R) integrated platform technology
is based on a proprietary multilayer PTFE process whereby fluoropolymer
composite substrates of different dielectric constant and thickness are fusion
bonded together to form a highly robust multilayer structure. The



fusion bonding process yields a highly reliable homogeneous multilayer stripline
structure with superior electrical and thermal performance across a wide
frequency and power range. The Multi-Mix(R) fusion bonded multilayer structure
is an enabling platform for embedding a wide range of RF and Microwave
semiconductor chips such as LDMOS, GaAs FET/MESFET and PHEMT, GaN, SiC, and
SiGe, etc., eliminating expensive discrete packages. This enabling platform
offers the capability to replace complex RF power amplifier circuitry with low
cost integrated modules, dramatically improving reliability and peak power
handling. Furthermore, by incorporating other active as well as passive circuit
elements, etched resistors, and plated-through via holes a three-dimensional
subsystem enclosure can be formed that requires no further packaging resulting
in significantly smaller, low cost and light weight products with enhanced
reliability and superior electrical and thermal performance."


ABOUT MERRIMAC

Merrimac Industries, Inc. is a leader in the design and manufacture of RF
Microwave signal processing components, subsystem assemblies, and Multi-Mix(R)
micro-multifunction modules (MMFM(R)), for the worldwide Defense, Satellite
Communications (Satcom), Commercial Wireless and Homeland Security market
segments. Merrimac is focused on providing Total Integrated Packaging
Solutions(R) with Multi-Mix(R) Microtechnology, a leading edge competency
providing value to our customers through miniaturization and integration.
Multi-Mix(R) MMFM(R) provides a patented and novel packaging technology that
employs a platform modular architecture strategy that incorporates embedded
semiconductor devices, MMICs, etched resistors, passive circuit elements and
plated-through via holes to form a three-dimensional integrated module used in
High Power, High Frequency and High Performance mission-critical applications.
Merrimac Industries facilities are registered under ISO 9001:2000, an
internationally developed set of quality criteria for manufacturing operations.

Merrimac Industries, Inc. has facilities located in West Caldwell, NJ, San Jose,
Costa Rica and Ottawa, Ontario, Canada, and has approximately 240 co-workers
dedicated to the design and manufacture of signal processing components, gold
plating of high-frequency microstrip, bonded stripline and thick metal-backed
Teflon (PTFE) micro-circuitry and subsystems providing Total Integrated
Packaging Solutions(R) for wireless applications. Merrimac (MRM) is listed on
the American Stock Exchange. Multi-Mix(R), Multi-Mix PICO(R), MMFM(R), System In
A Package(R), SIP(R) and Total Integrated Packaging Solutions(R) are registered
trademarks of Merrimac Industries, Inc. For more information about Merrimac
Industries, Inc. and its Canadian subsidiary Filtran Microcircuits Inc., please
visit http://www.merrimacind.com and http://www.filtranmicro.com .

This press release contains statements relating to future results of the Company
(including certain projections and business trends) that are "forward-looking
statements" as defined in the Private Securities Litigation Reform Act of 1995.
Actual results may differ materially from those projected as a result of certain
risks and uncertainties. These risks



and uncertainties include, but are not limited to: risks associated with demand
for and market acceptance of existing and newly developed products as to which
the Company has made significant investments, particularly its Multi-Mix(R)
products; the possibilities of impairment charges to the carrying value of our
Multi-Mix(R) assets, thereby resulting in charges to our earnings; slower than
anticipated penetration into the satellite communications, defense and wireless
markets; failure of our Original Equipment Manufacturer, or OEM, customers to
successfully incorporate our products into their systems; changes in product mix
resulting in unexpected engineering and research and development costs; delays
and increased costs in product development, engineering and production; reliance
on a small number of significant customers; the emergence of new or stronger
competitors as a result of consolidation movements in the market; the timing and
market acceptance of our or our OEM customers' new or enhanced products; general
economic and industry conditions; the risk that the benefits expected from the
Company's acquisition of Filtran Microcircuits Inc. are not realized; the
ability to protect proprietary information and technology; competitive products
and pricing pressures; our ability and the ability of our OEM customers to keep
pace with the rapid technological changes and short product life cycles in our
industry and gain market acceptance for new products and technologies; foreign
currency fluctuations between the U.S. and Canadian dollars; risks relating to
governmental regulatory actions in communications and defense programs; and
inventory risks due to technological innovation and product obsolescence, as
well as other risks and uncertainties as are detailed from time to time in the
Company's Securities and Exchange Commission filings. These forward-looking
statements are made only as of the date hereof, and the Company undertakes no
obligation to update or revise the forward-looking statements, whether as a
result of new information, future events or otherwise.