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Subsequent Events
9 Months Ended
Sep. 30, 2011
Subsequent Events [Abstract] 
Subsequent Events
Subsequent Events

Thailand Flooding

On October 19, 2011 the Company announced in a press release an update on the impact to its business from the continued flooding in Thailand. The Company believes that its SANYO Semiconductor division's manufacturing operations in Thailand, including buildings and equipment located at the Rojana Industrial Park in Ayutthaya, Thailand, have been severely damaged by the flood. Operations at this location remain suspended. The Company has not yet been able to enter its site and buildings and is uncertain as to when it will be able to gain access due to the extensive flooding. Based on currently available information and given the extent of the potential damage, the Company is unable to determine when it might be able to re-start probe, assembly and test operations at the Rojana Industrial Park, if at all. The future of this site will be evaluated once the Company is able to gain access to its facility.

The Company currently occupies approximately 160,000 square feet of production space and employs approximately 1,800 people, which includes approximately 350 subcontractors, at its Thailand Rojana Industrial Park facility.

Additionally, as a result of the flooding, the Company is in the process of evaluating the recoverability of the assets related to the Thailand Rojana Industrial Park facility. The Company has concluded, based on its preliminary evaluation, that an impairment charge of approximately $50.0 million to $65.0 million related to inventory, fixed assets and other assets located at the Rojana Industrial Park facility will be required to reduce the carrying value of the inventory, fixed assets and other assets to their expected recoverable values. The Company anticipates recording the impairment charge in the fourth quarter of 2011. These amounts are preliminary and subject to change as the Company finalizes its assessment of the charge and costs associated with the assets. The Company has insurance coverage up to approximately $50.0 million for the damage at this site; however, these proceeds will not fully offset the impact to the business as a result of the flooding of this site. The Company also cannot estimate the timing of its receipt of the proceeds that it ultimately receives from this coverage and there may be a substantial delay between its incurrence of losses and such recovery.

The Company also has operations located in an industrial park in Bang Pa In, Thailand, which has also recently been flooded. As a result, the Company has suspended operations at this facility as well. While the Company's equipment is located on the third floor, it has been unable to assess the potential damage to its equipment, inventory and production at this site. This facility currently occupies approximately 8,000 square feet of production space and employs approximately 150 people. The Company has approximately $50.0 million of additional insurance coverage for the Bang Pa In facility. The Company currently does not expect damages covered by the insurance for this facility to exceed the applicable coverage. However, the Company cannot estimate the timing of its receipt of the proceeds that it ultimately receives from this coverage and there may be a substantial delay between its incurrence of losses and such recovery.

The Rojana Industrial Park operations produced approximately 10% to 12% of our worldwide output as measured by third quarter 2011 revenues and the operations at the Bang Pa In facility produced approximately 2% to 3% of such output. Based on the Company's current assessment of the situation, it believes the flooding will negatively impact revenues and earnings for a minimum of three to four quarters beginning in the fourth quarter of 2011. The Company also currently believes that the negative impact to revenue directly related to the flooding of its Thailand manufacturing facilities, including the Bang Pa In facility, will be approximately $60.0 million in the fourth quarter of 2011. Additionally, the Company anticipates that there will be a significant impact on cash flow as well, both from decreased revenues and from increased costs associated with this event including expenses to restore production.

See Part I, Item 2 "Management's Discussion and Analysis of Financial Condition and Results of Operations - Operating Facilities" included elsewhere in this Form 10-Q for additional information relating to the effects of the Thailand flooding.

Aizu Facility Closure

On October 16, 2011, the Company committed to a plan to close its wafer manufacturing facility located in Aizu, Japan by the end of the second quarter of 2012 ("Aizu Plan"). Under the Aizu Plan, a majority of the Aizu, Japan production will be transferred to other Company-owned wafer fabrication facilities. The Aizu Plan is being undertaken as part of the Company's overall drive for operational efficiencies and is in line with an ongoing strategy aimed at migrating in-house production to large, high volume facilities, and investing in more advanced wafer technologies.

The Aizu Plan includes the elimination in workforce of approximately 197 full time and 94 contract employees at the Aizu site. These actions are expected to take place over the next twelve months and are expected to lower certain of the Company's costs. As a result of the Aizu Plan, the Company expects to incur cash charges beginning in the fourth quarter of 2011 of approximately $20.0 million to $25.0 million, which will include expected severance costs of approximately $14.0 million to $15.0 million and other exit costs of approximately $6.0 million to $10.0 million.

The above amounts are preliminary and subject to change as we finalize our assessment of the charges and costs associated with the above items. These charges and costs do not take into consideration any potential cost savings associated with the actual closure of the Aizu site.

(See Note 5: "Restructuring, Asset Impairments and Other, Net" for further discussion of the asset impairment charge recorded during the quarter ended September 30, 2011 associated with the Company's plan to close its wafer manufacturing facility located in Aizu, Japan.