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Proc-Type: 2001,MIC-CLEAR
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UNITED STATES
Washington,
D.C. 20549
FORM 6-K
Report of Foreign Private Issuer
Pursuant to Rule 13a-16 or 15d-16 of
the Securities Exchange Act of 1934
December, 2008
Commission File Number 0-26005
MICROMEM TECHNOLOGIES INC.
777 Bay Street, Suite 1910, Toronto, ON M5G 2C8
[Indicate by checkmark whether the registrant files or will file annual reports under cover Form 20-F or Form 40-F.]
Form 20-F
Q Form 40-F £[Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934.]
Yes £ No Q
[If Yes is marked, indicate below the file number assigned to the registrant in connection with rule 12g3-2(b): N/A
This report on Form 6-K is hereby incorporated by reference in the registration statement on Form F-3 (Registration No. 333-134309) of Micromem Technologies Inc. and in the prospectus contained therein, and this report on Form 6-K shall be deemed a part of such registration statement from the date on which this report is filed, to the extent not superseded by documents or reports subsequently filed or furnished by Micromem Technologies Inc. under the Securities Act of 1933 or the Securities Exchange Act of 1934.
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.
MICROMEM TECHNOLOGIES INC. |
|
|
By: /s/ Joseph Fuda |
Date: December 8, 2008 | Name: Joseph Fuda |
|
Title: Chief Executive Officer |
Exhibit Index
Exhibit | |
Number | Exhibit Description |
99.1 | Press Release Micromem Technologies Inc. Provides Technology Update |
Micromem Technologies Inc. Provides Technology Update
Company Surpasses Several Tech Milestones As It Enters Revenue Phase
Highlights Include: BAE Completion of Manufacturer of Wafers;
TAOS Third Party Validation of Magnetic Sensors; Potential Integration Into
Biometric Product Lines and 3-D Manufacturing "Paper Printing" Process
TORONTO, NEW YORK December 4, 2008 - Micromem Technologies Inc. (OTCBB: MMTIF), and its wholly owned U.S. subsidiary, Micromem Applied Sensor Technologies, Inc. (MASTInc), issues a technology update, focusing on recent product innovation, life cycle testing, and client contract support.
I. Product Innovation
1.
Micromem recently announced an industry-first design of an 80 x 80 dense array of its patented magnetic sensors, which the company believes to be the largest array of its kind ever developed. The sensors small footprint and very low cost per element enables Micromem to produce such a large array. The company responded to many of the applications that clients are requesting, which require customized dense arrays of magnetic sensors that dramatically enhance the limits of todays generation of device sensitivity, at a lower cost per pixel for data acquisition. This array will be made available to Micromems current evaluation clients for performance evaluation testing starting January 2009.
2.
Global Communications Semiconductor, Inc. has manufactured Micromems first array of MRAM. Full performance memory testing is ongoing and memory samples will be available to clients in late December 2008.
3.
BAE Systems, one of the largest defense companies in the world, has completed manufacturing of Micromems wafers and will deliver its initial products for third party validation and testing in December 2008. The BAE Systems wafers include both memory arrays and magnetic sensors. These wafers include Micromems patented technology manufactured on Department of Defense grade gallium arsenide substrate.
II. Life Cycle Testing
1.
Texas Advanced Optical Systems (TAOS), leading developers, manufacturers, and marketers of integrated optoelectronic product, has completed third party validation testing of Micromems patented magnetic sensors. TAOS has validated that the sensor performs as well as or better than Micromems published product data sheet. The partnership could bring a significant distribution opportunity to Micromem, as TAOS has a large-scale global network of clients. As the relationship matures, Micromem intends on using TAOS as its distribution partner to deliver product worldwide.
II. Client Contract Support
1.
AuthenTec, a supplier of over 50% of the biometric applications sold in the U.S., has begun testing of Micromems magnetic sensor for potential integration into its product line. Micromems sensor is sensitive enough to recognize capillaries in the finger, which will reduce the number of false positives in current biometric technology. A joint development agreement is expected to commence shortly.
2.
Norwegian EM Technology AS of Norway has begun testing of Micromems magnetic sensors for integration into an application that involves natural resource exploration of minerals and oils. The company plans to map the small perturbations in the earths magnetic field.
3.
MASTInc, has completed an agreement with Nth Degree of Arizona to investigate integration of its disruptive next generation electronics manufacturing technology. Nth-Degree has developed a statistical manufacturing printing process for rendering electronics using printing technologies with conductive inks. MASTInc plans to further reduce its product feature size and incorporate Micromems magnetic sensors into Nth Degrees electronic inks, which will then be integrated into mass production applications for producing electronic circuits via a printing process. MASTInc considers this technology as an innovate way to reliably mass-produce extremely dense sensor arrays at very lo cost with very high accuracy. One of the problems facing arrayed electronics is to interconnect the massive number of electronic elements within a solution. With Nth Degrees technology, Micromems solution will be printed, not placed, not unlike a conventional paper machine operation. This statistical 3-D manufacturing process will allow Micromem to produce extremely high density low cost customized sensor arrays that will provide many customers with a highly reliable solution for current unmet and outstanding application needs in the military, homeland security, and medical diagnostic fields.
"As the company moves into its revenue phase, our client commitment has accelerated the technological timeline resulting in these very positive milestones," said Steven Van Fleet, MASTInc President. "Given the developments outlined here, this is a very exciting time for the company. We are pleased to offer these updates and look forward to making further updates available to our shareholders as we continue along our technology roadmap."
About Micromem and MASTInc
MASTInc is a wholly owned U.S.-based subsidiary of Micromem Technologies Inc., a publicly traded (OTC: MMTIF) fables semiconductor company with headquarters in Toronto, Canada and an office in New York City. Micromem holds and continues to develop a broad-based patent portfolio of Magnetoresistive Random Access Memory (MRAM) and magnetic sensor technologies. Micromems MRAM patents create a solution for performance driven, radiation hard, non-volatile memory applications. MASTInc is focused on business development efforts and is working on the launch of sensory products for use in both defense and consumer applications. Its first product, GC-0301, is far superior to the competition with over 200 V/T, making it one of the most sensitive hall sensors on the market without the need for external amplification. MASTInc is working with companies that have large-scale capabilities and expects to sign contracts in the coming quarters.
Safe Harbor Statement
This press release contains forward-looking statements. Such forward-looking statements are subject to a number of risks, assumptions and uncertainties that could cause the Companys actual results to differ materially from those projected in such forward-looking statements. In particular, factors that could cause actual results to differ materially from those in forward looking statements include, our inability to obtain additional financing on acceptable terms, risk that our products and services will not gain widespread market acceptance; continued consumer adoption of digital technology, inability to compete with others who provide comparable products, the failure of our technology, inability to respond to consumer and technological demands, inability to replace significant customers; seasonal nature of our business and other risks detailed in our filings with the Securities and Exchange Commission. Forward-looking statements speak only as of the date made and are not guarantees of future performance. We undertake no obligation to publicly update or revise any forward-looking statements. When used in this document, the words "believe," "expect," "anticipate," "estimate," "project," "plan," "should," "intend," "may," "will," "would," "potential," and similar expressions may be used to identify forward-looking statements.
Listing: NASD OTC-Bulletin Board - Symbol: MMTIF
Shares issued: 83,186,667
SEC File No: 0-26005
Contact:
The Investor Relations Group, Inc.
(212) 825-3210
Adam Holdsworth James Carbonara
or
Public Relations
Susan Morgenbesser Andrew Conn