6-K 1 d478409d6k.htm FORM 6-K Form 6-K

1934 Act Registration No. 1-14700






Washington, DC 20549







PURSUANT TO RULE 13a-16 OR 15d-16 OF


For the month of October 2017



Taiwan Semiconductor Manufacturing Company Ltd.

(Translation of Registrant’s Name Into English)



No. 8, Li-Hsin Rd. 6,

Hsinchu Science Park,


(Address of Principal Executive Offices)



(Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.)

Form 20-F  ☒            Form 40-F  ☐

(Indicate by check mark whether the registrant by furnishing the information contained in this form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934.)

Yes  ☐            No  ☒

(If “Yes” is marked, indicated below the file number assigned to the registrant in connection with Rule 12g3-2(b): 82:             .)





Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.


    Taiwan Semiconductor Manufacturing Company Ltd.
Date: October 19, 2017     By  

/s/ Lora Ho

      Lora Ho
      Senior Vice President & Chief Financial Officer


TSMC Reports Third Quarter EPS of NT$3.47

Hsinchu, Taiwan, R.O.C., Oct 19, 2017 — TSMC today announced consolidated revenue of NT$252.11 billion, net income of NT$89.93 billion, and diluted earnings per share of NT$3.47 (US$0.57 per ADR unit) for the third quarter ended September 30, 2017.

Year-over-year, third quarter revenue decreased 3.2% while net income and diluted EPS both decreased 7.1%. Compared to second quarter 2017, third quarter results represented a 17.9% increase in revenue and a 35.7% increase in net income. All figures were prepared in accordance with TIFRS on a consolidated basis.

In US dollars, third quarter revenue was $8.32 billion, which increased 17.9% from the previous quarter and increased 1.5% year-over-year.

Gross margin for the quarter was 49.9%, operating margin was 38.9%, and net profit margin was 35.7%.

In the third quarter, shipments of 10-nanometer accounted for 10% of total wafer revenue; 16/20-nanometer process technology accounted for 24% of total wafer revenue; and advanced technologies, defined as 28-nanometer and more advanced technologies, accounted for 57% of total wafer revenue.

“The strength of our third quarter revenue was driven mainly by major mobile product launches and a generally healthy demand environment, including cryptocurrency mining. However, this strength of our third quarter revenue was partially dampened by our customers’ continued inventory management,” said Lora Ho, SVP and Chief Financial Officer of TSMC. “We expect our fourth quarter business will continue to be supported by the major mobile product launches, while our customers continue their inventory management. Based on our current business outlook, management expects the overall performance for fourth quarter 2017 to be as follows”:


  Revenue is expected to be between US$9.10 billion and US$9.20 billion;

And, based on the exchange rate assumption of 1 US dollar to 30.3 NT dollars,


  Gross profit margin is expected to be between 48% and 50%;


  Operating profit margin is expected to be between 37% and 39%.

The management further expects the 2017 capital budget to be about US$10.8 billion.



TSMC’s 2017 Third quarter consolidated results:

(Unit: NT$ million, except for EPS)










Inc. (Dec.) %






Inc. (Dec.) %


Net sales

     252,107        260,406        (3.2      213,856        17.9  

Gross profit

     125,880        132,051        (4.7      108,708        15.8  

Income from operations

     98,056        106,263        (7.7      83,256        17.8  

Income before tax

     100,518        108,250        (7.1      86,118        16.7  

Net income

     89,925        96,759        (7.1      66,271        35.7  


     3.47 b        3.73 b        (7.1      2.56 b        35.7  

a: 3Q2017 figures have not been approved by Board of Directors

b: Based on 25,930 million weighted average outstanding shares

About TSMC

TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry’s largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company’s owned capacity in 2017 is expected to reach above 11 million (12-inch equivalent) wafers, including capacity from three advanced 12-inch GIGAFAB® facilities, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC China. TSMC is the first foundry to provide both 20nm and 16nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.

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TSMC Spokesperson:


Lora Ho

Senior VP & CFO

Tel: 886-3-505-4602


TSMC Acting Spokesperson:


Elizabeth Sun

Senior Director

Corporate Communications Division

Tel: 886-3-568-2085

Mobile: 886-988-937-999

E-Mail: elizabeth_sun@tsmc.com


For Further Information:


Michael Kramer

Project Manager

Tel: 886-3-563-6688

Ext. 7125031

Mobile: 886-988-931-352

E-Mail: pdkramer@tsmc.com




Hui-Chung Su

Senior Administrator

PR Department

Tel: 886-3-563-6688

Ext. 7125033

Mobile: 886-988-930-039

E-Mail: hcsuq@tsmc.com