Exhibit 99.6

101 Applications enabled by lithography

Some facts and trends......... Lithography is at the heart of many applications we take for granted every day These applications outperform logic and memory devices in growth They are very high tech, but in a different form There are many materials other than silicon Applications are only limited by human imagination A few examples of applications.... Semiconductor companies find niche markets or start Micro- ElectroMechanical Systems foundries; 200 mm wafer fabs with older generations systems are increasingly being used

Some examples Some examples Lab on a Chip (LOC) for counting red blood cells DNA analysis (?Affymetrix) Camera pill with image sensor, RF circuitry, processor and memory Gyroscopes in the iPhone (?Apple) Micro-mirrors for beamers (?TI) (?TI) (?TI) 40 ?Watt Energy Harvester (?IMEC)

Some of the big players in these markets MicroElectroMechanical Systems (MEMS) HP: inkjet heads ST Microelectronics: accelerometers Texas Instruments: micro-mirrors Robert Bosch: pressure sensors, accelerometers TSMC starting up a MEMS foundry activities Thin Film Head (TFH) Seagate Technologies: HDD Western Digital: HDD Hitachi Global Storage Technologies: HDD Fujitsu: HDD TDK Group: TFH foundry

The program Peter ten Berge Diversity of MicroElectroMechanical Systems (MEMS) Widespread use of Compound Semiconductors High end tech of Thin Film Heads (TFH) in Hard Disk Drive (HDD) Henk van Zeijl Applications at DIMES (Delft Institute of MicroElectronics and Submicron technology, Technical University of Delft) Time for questions

Focus on lithography applications

Now we'll shed some light on MicroElectroMechanical Systems (MEMS) Compound semiconductors Thin Film Heads (TFH)

Now we'll shed some light on MicroElectroMechanical Systems (MEMS) Compound semiconductors Thin Film Heads (TFH)

The MEMS market is diverse and booming Source: Yole development 2008 Source: Yole development 2008 Gyroscope (? UC Irvine) Gyroscope (? UC Irvine) Si microphone Si microphone Accelerometer (? IC Mechanics) Accelerometer (? IC Mechanics) Pressure sensor (? ST) Revenues 2007 ~ 7 B$ CAGR 2007-2012 Revenues: 17% Units: 32% Telecommunication Automotive Medical Consumer IT peripherals

MEMS technology is often bulk production MEMS segment Technology & working principle Inkjet Heads Bulk, Drop-on-demand, thermal / piezo Pressure Sensors Bulk / surface, capacitive / piezo Inertial Sensors Bulk / Surface, capacitive RF MEMS Surface, large variation of working principles Si Microphones Bulk / Surface, capacitive Magnetic Sensors Surface, Hall effect / AMR / GMR Chipworks.com ASML/MicroChem IBM High topology imaging Double side alignment Planar Bulk

3DAlignTM is a patented revolutionary technology developed for the MEMS market New technology supporting the transition from contact aligners to reduction projection lithography Top Lens Wafer Side View Wafer table Optics alignment marker

Now we'll shed some light on MicroElectroMechanical Systems (MEMS) Compound semiconductors Thin Film Heads (TFH)

Compound semiconductor (III-V, IV) devices can be found everywhere Source: Yole Development 2008 Emerging litho applications Volume litho applications

High power at high frequencies: Use of compound semiconductors Eg bandgap Vs velocity Breakdwn field Thermal conduct. [eV] [107cm/s] [MV/cm] [W.K/cm] Si 1.1 1.0 0.3 1.5 GaAs 1.4 1.3 0.4 0.5 SiC 3.2 2.0 3.0 4.9 GaN 3.4 2.7 3.0 1.5 Source: RFMD 2005

Compound: SAW filters, new applications require higher frequencies Source: Epcos 2008 Applications technology LiNbO3

Trend: towards integration of photonics Source: Intel Source: Intel Photonics circuits use many different compounds CMOS circuitry is made on silicon and others on f.i. Indium Phosphide (InP) Big push to integrate all these functions onto one substrate

Compound devices with better performance More power Higher frequencies Broader bandwidths Si GaAs SiC GaN LiNbO3 Small wafer handling Non-Si wafer handling Dedicated (process) support Pushing resolution / wavelength

Now we'll shed some light on MicroElectroMechanical Systems (MEMS) Compound semiconductors Thin Film Heads (TFH)

Digital storage: life logging a next killer app ? In 2007 a total of 281 Exabytes were generated ^ 43 GB/person 1 Exabyte = 1,000,000,000 Gigabytes (GB) Digital footprint / person will increase > 15x in the next 7 years Wearable personal video technology for life logging Source: Coughlin Associates Jan 2008 Source: Coughlin Associates Jan 2008

Source: HGST, IDEMA Dec 2007, Coughlin Associates 2008 Storage requirements drive huge HDD demand, to >2,000,000,000 TFHs per year by 2010 One Thin Film Head is an integrated Read Head / Write Head device

New technologies are introduced to support the areal density roadmap Source: Seagate, IDEMA Dec 2007 Magnetic medium Read sensor Write head coils Perpendicular recording (current state of art) Heat assisted magnetic recording Patterned media Disk rotates along this axis

Source: IBM, Bob Fontana, DiskCon Sept 2008 Smallest CD < 40 nm Overlay 9 nm CD control 5 nm $/GB ratio ^ areal (bit) density ^ tight litho requirements By 2010 requirements are close to ITRS TFH HDD storage capacity: Areal Density is the driver

High end IC & TFH litho: many differences TFH industry uses litho tools with their roots in the IC industry IC TFH Comment Wafer material Si AlTiC 2x heavier/m2 Wafer diameter 300 mm 150-200 mm risk of obsolete equipment Wafer thickness 775 ^m 1200-2000 ^m not a SEMI standard Dies / wafer ~1,000 40,000-70,000 fewer wafers required Field wafer layout n.a. rowbar layout absolute grid Dielectric thickness < 0.3 ^m > 3 ^m tight OPO Resist thickness < 0.2 ^m 0.2-1.0 ^m wavelength / resist choice Feature type dense L&S iso line & trench litho extendibility Wavelength ArFi ArF / KrF NA / l vs. dose / focus Throughput scanner limited track limited "idle" time scanner

AlTiC vs Si: Increasing the overlay challenge AlTiC (64% Al2O3 - 36%Ti - C) AlTiC (64% Al2O3 - 36%Ti - C) AlTiC (64% Al2O3 - 36%Ti - C) Si Phase Phase Amorphous Crystalline Crystalline Thermal expansion (ppm/C) Thermal expansion (ppm/C) 7.5, isotropic 2.5, anisotropic 2.5, anisotropic Thermal conductivity (W/m.K) Thermal conductivity (W/m.K) 25 150 150 Typical exposure time of a wafer falls in this range Si AlTiC Lot of 3 AlTiC wafers World Class Performance

ASML is market & technology leader in TFH TFH fab ~ 65% of all TFHs are made using ASML lithography tools

Thank you for your attention