6-K

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

FORM 6-K

REPORT OF A FOREIGN ISSUER
PURSUANT TO RULE 13A-16 OR 15D-16
OF THE SECURITIES EXCHANGE ACT OF 1934

For September, 2007

ASML Holding N.V.

De Run 6501
5504 DR Veldhoven
The Netherlands
(Address of principal executive offices)

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F þ      Form 40-F o

Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934.

Yes o      No þ

If “Yes” is marked, indicate below the file number assigned to the registrant in connection with Rule 12g3-2(b):

Exhibits

99.1	Citigroup 2007 Technology Conference, New York, NY, presentation dated September 6, 2007
99.2	ASML i-Line Scanners Achieve New Level of Productivity: Taiwanese Customer Processes Record 3,596 wafers in Single Day, press release dated September 12, 2007
99.3	Deutsche Bank 2007 Technology Conference, London, presentation dated September 14, 2007
99.4	ASML Issued Share Capital Notification, notice dated September 17, 2007
99.5	ASML Record Date for Capital Repayment and Reverse Stock Split, press release dated September 25, 2007
99.6	ASML Issued Share Capital Notification, notice effective September 28, 2007

          “Safe Harbor” Statement under the U.S. Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements that are subject to risks and uncertainties including, but not limited to, economic conditions, product demand and industry capacity, competitive products and pricing, manufacturing efficiencies, new product development, ability to enforce patents, availability of raw materials and critical manufacturing equipment, trade environment, and other risks indicated in filings with the U.S. Securities and Exchange Commission.

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TABLE OF CONTENTS

EX-99.1

EX-99.2

EX-99.3

EX-99.4

EX-99.5

EX-99.6

SIGNATURES

          Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

	ASML HOLDING N.V. (Registrant)
Date: October 4, 2007	By:	/s/ Peter T.F.M. Wennink
		Peter T.F.M. Wennink
		Executive Vice President and Chief Financial Officer

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EX-99.1

Exhibit 99.1

Citigroup 2007 Technology Conference New York, New York Craig DeYoung VP Investor Relations September 06, 2007

Safe Harbor "Safe Harbor" Statement under the U.S. Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements that are subject to risks and uncertainties including, but not limited to: economic conditions, product demand and semiconductor equipment industry capacity, worldwide demand and manufacturing capacity utilization for semiconductors (the principal product of our customer base), competitive products and pricing, manufacturing efficiencies, new product development, ability to enforce patents, the outcome of intellectual property litigation, availability of raw materials and critical manufacturing equipment, trade environment, and other risks indicated in the risk factors included in ASML's Annual Report on Form 20-F and other filings with the U.S. Securities and Exchange Commission.

ASML overview - The world's leading provider of lithography systems for the semiconductor industry Established: 1984 Headquarters: Veldhoven, the Netherlands Market cap ~ €10 B Employees ~ 6,200 Customers: Serving 17 of the top 20 semi mfg. Equity Listing: Nasdaq and Euronext Key facts Key financials € million 2005 2006 H1 2007 Market share (based on revenue) 57% 63% 66% Net sales 2,529 3,597 1895 Gross profit 974 1,462 777 EBIT 449 871 405 Leaders in Innovation ASML TWINSCAN Ranked in the top 3 for customer satisfaction for the 5th consecutive year

Sources: ASML MCC, VLSI Research, iSuppli, SIA Industry growth drives Lithography tool consumption - NAND Flash fastest growing DRAM LOGIC NAND NOR ANALOG MICRO Other 0 10 20 30 40 50 60 0 5 10 15 20 25 30 CAGR Exposure Area 06-09 [%] Exposure area 2006 [SI*10^9] Segment size: 20 Bio. US$

NAND Flash Customer Roadmaps drive Lithograph tool development Jan-00 Jan-02 Jan-04 Jan-06 Jan-08 Jan-10 Jan-12 Half Pitch (nm) 200 100 80 60 40 Logic DRAM Half Pitch status : Logic = 65~90nm DRAM = 60~80nm NAND = 55~65nm

ASML Lithography Roadmap 300mm

ASML TWINSCAN? Product Specifications Continuous Improvement

ASML roadmap enables shrink for Logic, DRAM, and NAND flash at time required Source: Various customers, dates determine production start/qualification 10 12 200 100 80 60 40 11 07 09 08 04 06 05 01 03 02 00 Resolution/half pitch "Shrink" [nm] Year ASML Product Introduction XT:1400 XT:1700i AT:1200 AT:850 XT:1900i k1=0.4 k1=0.27 Logic DRAM R&D R&D NAND XT:1450 Double Patterning

84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 Region 1 0 1 2.5 8.5 7.5 10.5 11.5 10.5 21 21 19 19.5 25.5 31 36 41 41 30 54 45 53 56.5 63 Technology in Time helps grow market share Technology in Time helps grow market share Technology in Time helps grow market share Total market: €4,800 million Total market: €463 million ASML market share (revenue) - Nearly tripled in 10 years 1984 2006 Perkin Elmer Canon GCA Ultratech Eaton Nikon ASET Hitachi 1984 4 2 37 12 5 35 2 3 ASML Nikon Canon 63 21 16 Source: SEMI, Gartner Dataquest 8" & i-line 8" & i-line 6" & early i-line KrF & Step & Scan 12" & ArF Immersion

KrF ArF dry ArF wet I line East 15 37 42 6 West North Immersion - Leadership continues Over 50 systems shipped to date to all applications and geographies in the world 25 immersion machines in backlog valued at € 728 M Received repeat orders from major Japanese customers including multiple XT:1900i machines ASML plans to ship about 35 immersion machines in 2007 Backlog in value i-line 6% KrF 15% ArF dry 37 % ArF Immersion is 42% of backlog

First TWINSCAN XT:1900i shipped on schedule early July First tool in the world capable of printing features below 40 nm in volume production in volume production in volume production

Over 2 Million wafers processed on ASML immersion systems with steep production ramp since April 2007 systems with steep production ramp since April 2007 systems with steep production ramp since April 2007 Wafers exposed on ASML immersion equipment

1 10 100 1985 1990 1995 2000 2005 2010 Year Lithography System costs will continue to rise Relative List Price i-line 300mm 200mm 150mm KrF ArF ArFi EUV? Wafer Size Wavelength Stepper Platform Step & Scan Dual Stage 0.4 0.5 0.6 0.7 0.8 0.93 1.2 1.35 Aperture

Average Selling Price (ASP) grows 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 3.59 4.38 5.4 5.9 6.8 8.92 9.46 9.28 13.54 14.01 MSGraph.Chart.8 MSGraph.Chart.8 ASML ASP new systems KrF & Step & Scan 300mm & ArF 300mm & ArF ArF volume & ArFi

Are lithography systems becoming unaffordable? 1 10 100 1,000 10,000 1986 1988 1990 1992 1994 1996 1998 2000 2002 2004 2006 2008 150mm 200mm 300mm Relative price increase = 40% / generation Relative productivity increase (mm2/hour) = 30% / generation Relative shrink increase (pixels/field) = 100% / generation Relative cost reduction (pixels/hour/MEuro) = 60% / generation

Lithography Affordability for Future Shrink Relative Performance 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2.0 AT:1150C XT:1400E XT:1900i NEXTi EUVL 90nm 65nm 40nm 28* 22 2003 2005 2007 2009 2011 4GB 8GB 16GB 32GB 64GB Relative System Cost Relative System WPH Relative Cost / Function / Hour Model Resolution Year NAND Flash 2.6 2.2 2.4 * Double Patterning

ASML Competitive Advantage 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2004 2005 2006 2007 2008 ASML ArF Competition ArF ASML ArFi Competition ArFi Pixels per Hour per Million Euro

Summary Shrinking design rules have been the economical driver of the IC industry. Lithography remains the key enabler Providing the right product at the right time allows market share gains for ASML Shrinking design rules require increasingly more sophisticated lithography systems resulting in a steady growth in their cost and resulting ASP's ASML insures that the increasing cost of advanced lithography systems remain acceptable by developing solutions that result in maximum usable shrink while driving increased productivity to ensure steady improvement in cost per function Future lithography technologies will likely ensure that the economics of shrink will remain attractive for at least several more generations

Commitment

EX-99.2

Exhibit 99.2

ASML i-Line Scanners Achieve New Level of Productivity: Taiwanese Customer Processes Record 3,596 wafers in Single Day

TAIPEI, Taiwan – SEMICON Taiwan 2007 – Sept 12, 2007 – ASML Holding NV (ASML) today announced that a Taiwanese customer using its TWINSCAN™ i-Line scanners has achieved an unprecedented level of 300mm productivity by processing 150 wafers per hour for 24 hours, reaching a record output of 3,596 wafers in a single day.

These recent results were achieved using a TWINSCAN XT:400F i-Line scanner, one of more than 700 TWINSCAN systems installed worldwide. TWINSCAN systems employ ASML’s patented dual-stage wafer-processing technology, where both stages alternate between metrology and imaging functions to enable non-stop wafer imaging. Later this year the range of i-Line scanners will be complemented by the new XT:400G model, which will increase throughput by another 10 percent.

The new record proves the significant value of ownership benefits of these systems for semiconductor manufacturers, while also allowing them to use less of their valuable factory floor space for i-Line processes. ASML’s 300-millimeter (mm) i-Line scanners are built on the same TWINSCAN platform as its other 300-mm scanners, offering chipmakers the potential for easy upgrades and better matching performance. Memory chipmakers in particular are benefiting from the high productivity of ASML’s i-Line scanners, which work seamlessly with advanced KrF and ArF systems.

“Our i-Line machines are future-proof. Not only do they offer the highest industry throughput, they also provide the tightest overlay available for 45-nm processes in volume production,” said Bert Koek, general manager of 300-mm business at ASML. “Overlay in the back-end layers will be one of the critical success factors in coming years as memory chip makers move to 45-nm immersion lithography.”

ASML’s 300 mm i-Line lithography systems – which offer a mature, yet efficient technology for imaging relatively large chip features – are gaining popularity with chipmakers because of their high performance and low cost. The unique combination of advanced technology and high productivity has helped i-Line lithography remain an essential technology for chipmakers seeking to optimize their production infrastructure.

“i-Line remains an excellent technology for necessary, but less critical, 250-nanometer (nm) chip features,” said Klaus Rinnen, Managing Vice President, Gartner, Inc.. “Even after advanced lithography moves on to 45-nm and smaller device features, there is still going to be a significant place for i-Line for many years to come.”

ASML sold 30 300-mm i-Line machines in the first half of 2007, more than the total number sold during 2006.

About the productivity numbers

The record 3,596 wafers processed in a single day were processed on the TWINSCAN XT:400F 300-mm i-Line system during the second quarter of 2007. The average productivity of all ASML’s i-Line machines is up almost 30 percent since November 2006.

About i-Line

i-Line refers to the type of light source used to project circuit patterns onto silicon wafers. i-Line source light has a wavelength of 365-nm, which ASML manipulates to print circuit features smaller than 250-nm. A nanometer is one millionth of a millimeter. ASML also makes lithography systems that use the smaller wavelengths produced by KrF and ArF light sources to print features as small as 40-nm. Chipmakers often use all three types of systems to produce a single chip, which can require up to 30 or 40 layers. ArF and KrF systems typically are used to image the smallest and mid-sized features of a chip, while larger, non-critical features are imaged using an i-Line light source.

About ASML

ASML is the world’s leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML.

Media Relations Contacts
Ryan Young – Corporate Communications – +31.40.268.3627
Lucas van Grinsven – Corporate Communications – +31.40.268.3949 – Veldhoven, NL

Investor Relations Contacts
Craig DeYoung – Investor Relations – +1.480.383.4005 – Veldhoven, NL
Franki D’Hoore – Investor Relations – +31.40.268.6494 – Veldhoven, NL

EX-99.3

Exhibit 99.3

Deutsche Bank 2007 Technology Conference London Franki D'Hoore Director Investor Relations 14 September, 2007

Safe Harbor "Safe Harbor" Statement under the U.S. Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements that are subject to risks and uncertainties including, but not limited to: economic conditions, product demand and semiconductor equipment industry capacity, worldwide demand and manufacturing capacity utilization for semiconductors (the principal product of our customer base), competitive products and pricing, manufacturing efficiencies, new product development, ability to enforce patents, the outcome of intellectual property litigation, availability of raw materials and critical manufacturing equipment, trade environment, and other risks indicated in the risk factors included in ASML's Annual Report on Form 20-F and other filings with the U.S. Securities and Exchange Commission.

ASML overview - The world's leading provider of lithography systems for the semiconductor industry Established: 1984 Headquarters: Veldhoven, the Netherlands Market cap ~ €10 B Employees ~ 6,200 Customers: Serving 17 of the top 20 semi mfg. Equity Listing: Nasdaq and Euronext Key facts Key financials € million 2005 2006 H1 2007 Market share (based on revenue) 57% 63% 66% Net sales 2,529 3,597 1895 Gross profit 974 1,462 777 EBIT 449 871 405 Leaders in Innovation ASML TWINSCAN Ranked in the top 3 for customer satisfaction for the 5th consecutive year

Sources: ASML MCC, VLSI Research, iSuppli, SIA Industry growth drives Lithography tool consumption - NAND Flash fastest growing DRAM LOGIC NAND NOR ANALOG MICRO Other 0 10 20 30 40 50 60 0 5 10 15 20 25 30 CAGR Exposure Area 06-09 [%] Exposure area 2006 [SI*10^9] Segment size: 20 Bio. US$

NAND Flash Customer Roadmaps drive Lithograph tool development Jan-00 Jan-02 Jan-04 Jan-06 Jan-08 Jan-10 Jan-12 Half Pitch (nm) 200 100 80 60 40 Logic DRAM Half Pitch status : Logic = 65~90nm DRAM = 60~80nm NAND = 55~65nm

ASML Lithography Roadmap 300mm

ASML TWINSCAN? Product Specifications Continuous Improvement

ASML roadmap enables shrink for Logic, DRAM, and NAND flash at time required Source: Various customers, dates determine production start/qualification 10 12 200 100 80 60 40 11 07 09 08 04 06 05 01 03 02 00 Resolution/half pitch "Shrink" [nm] Year ASML Product Introduction XT:1400 XT:1700i AT:1200 AT:850 XT:1900i k1=0.4 k1=0.27 Logic DRAM R&D R&D NAND XT:1450 Double Patterning

84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 Region 1 0 1 2.5 8.5 7.5 10.5 11.5 10.5 21 21 19 19.5 25.5 31 36 41 41 30 54 45 53 56.5 63 Technology in Time helps grow market share Technology in Time helps grow market share Technology in Time helps grow market share Total market: €4,800 million Total market: €463 million ASML market share (revenue) - Nearly tripled in 10 years 1984 2006 Perkin Elmer Canon GCA Ultratech Eaton Nikon ASET Hitachi 1984 4 2 37 12 5 35 2 3 ASML Nikon Canon 63 21 16 Source: SEMI, Gartner Dataquest 8" & i-line 8" & i-line 6" & early i-line KrF & Step & Scan 12" & ArF Immersion

KrF ArF dry ArF wet I line East 15 37 42 6 West North Immersion - Leadership continues Over 50 systems shipped to date to all applications and geographies in the world 25 immersion machines in backlog valued at € 728 M Received repeat orders from major Japanese customers including multiple XT:1900i machines ASML plans to ship about 35 immersion machines in 2007 Backlog in value i-line 6% KrF 15% ArF dry 37 % ArF Immersion is 42% of backlog

First TWINSCAN XT:1900i shipped on schedule early July First tool in the world capable of printing features below 40 nm in volume production in volume production in volume production

Over 2 Million wafers processed on ASML immersion systems with steep production ramp since April 2007 systems with steep production ramp since April 2007 systems with steep production ramp since April 2007 Wafers exposed on ASML immersion equipment

180nm 130nm 90nm 65nm The layout designers draw, is not quite what gets printed by scanners

Why is this happening? Because the litho process is not an error-free transfer function Mask-writing Wafer exposure Resist development Etch H ^ 1

What can we do about it? Software compensation for the distortion H .... .... .... ~1/H

Mask (with correction, or "RET/OPC") Silicon Image w/o correction Design Layout Mask (no correction) Silicon Image with RET/OPC In practice...

What does Brion do? Mask-writing Wafer exposure Resist development Etch H ^ 1 Accurate mathematical model of "H" Designers drawing Simulated wafer, before you print anything

With an accurate mathematical model of H, we can do two things: Compensate on design Compensate on scanner i.e. Approximate 1/H i.e. Find H' so distortion is less and/or easier to compensate for Brion's Tachyon OPC+ product line Scanner tuning

Through accurate model, we can fine tune many system settings for optimum exposure of each device pattern, reticle & wafer Lens Illuminator Sigma Pupicom PSEs DOEs Dose Unicom Etc. Stages Laser Bandwidth NA Manipulators Focus Tilt X Tilt Y Reticle height Synchronization

Synergies of owning the scanner and the litho model for scanner-tuning System setting ranges : NA range Illumination option/ranges standard & custom DoseMapper correction range etc. Actual system data Lens heating characteristics Aberration data Stray light Laser bandwidth etc. Wafer metrology & exposure data: Focus & Leveling & focus hot spot data Dose error, Laser data etc. Optimum system settings : NA Illumination setting (standard, custom) Focus, Dose settings etc. Real time system optimisation : Lens manipulator settings Exposure dose & DoseMapper offsets Focus & tilt by shot / wafer Laser bandwidth Alignment & wafer grid offsets / field/wafer Other

The holy-grail of optimisation: today, only ASML can do this Optimized Scanner (e.g. Illumination) Non - Optimized Mask Top-down photoresist Optimize both the scanner and the mask, together, as a unified optimization problem

With Brion, ASML now can... (1/2) Leverage a whole new dimension of possibilities for optimizing imaging performance (mask optimization, RET/OPC) as an integral part of its solution package Use an accurate model of the lithography process to tune the dozens of scanner knobs available so to further optimize imaging performance (scanner tuning) Through the two points above, enable faster shrink and higher yield for our customers

With Brion, ASML now can... (2/2) Further secure the ArF roadmap until EUV is ready Prevent value-migration to EDA by capturing software solutions to printability Penetrate a new and growing market at the interface with EDA, capturing new value streams and enabling growth beyond "hardware"

1 10 100 1985 1990 1995 2000 2005 2010 Year Lithography System costs will continue to rise Relative List Price i-line 300mm 200mm 150mm KrF ArF ArFi EUV? Wafer Size Wavelength Stepper Platform Step & Scan Dual Stage 0.4 0.5 0.6 0.7 0.8 0.93 1.2 1.35 Aperture

Average Selling Price (ASP) grows 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 3.59 4.38 5.4 5.9 6.8 8.92 9.46 9.28 13.54 14.01 MSGraph.Chart.8 MSGraph.Chart.8 ASML ASP new systems KrF & Step & Scan 300mm & ArF 300mm & ArF ArF volume & ArFi

Are lithography systems becoming unaffordable? 1 10 100 1,000 10,000 1986 1988 1990 1992 1994 1996 1998 2000 2002 2004 2006 2008 150mm 200mm 300mm Relative price increase = 40% / generation Relative productivity increase (mm2/hour) = 30% / generation Relative shrink increase (pixels/field) = 100% / generation Relative cost reduction (pixels/hour/MEuro) = 60% / generation

Lithography Affordability for Future Shrink Relative Performance 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2.0 AT:1150C XT:1400E XT:1900i NEXTi EUVL 90nm 65nm 40nm 28* 22 2003 2005 2007 2009 2011 4GB 8GB 16GB 32GB 64GB Relative System Cost Relative System WPH Relative Cost / Function / Hour Model Resolution Year NAND Flash 2.6 2.2 2.4 * Double Patterning

ASML Competitive Advantage 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2004 2005 2006 2007 2008 ASML ArF Competition ArF ASML ArFi Competition ArFi Pixels per Hour per Million Euro

Summary Shrinking design rules have been the economical driver of the IC industry. Lithography remains the key enabler Providing the right product at the right time allows market share gains for ASML Shrinking design rules require increasingly more sophisticated lithography systems resulting in a steady growth in their cost and resulting ASP's ASML insures that the increasing cost of advanced lithography systems remain acceptable by developing solutions that result in maximum usable shrink while driving increased productivity to ensure steady improvement in cost per function Future lithography technologies will likely ensure that the economics of shrink will remain attractive for at least several more generations

Commitment

EX-99.4

Exhibit 99.4

ASML Issued Share Capital Notification

On September 17, 2007, ASML Holding NV notified the Netherlands Authority for the Financial Markets (AFM) of an increase in ASML’s issued share capital.

ASML’s issued share capital has increased by approximately 2.9% and, as of September 17, 2007, consisted of 492,362,288 Ordinary Shares.

Information on ASML’s share capital is publicly available via: www.afm.nl/registers.

EX-99.5

Exhibit 99.5

ASML Confirms Record Date for Capital Repayment and Reverse Stock Split

VELDHOVEN, the Netherlands, September 25, 2007 – ASML Holding NV (ASML) today confirmed that none of its creditors has opposed the capital repayment and/or reverse stock split.

Therefore, the record date of the repayment of EUR 2.04 per ordinary share and the consolidation of all outstanding ordinary shares (the reverse stock split) is now unconditionally set for September 28, 2007.

About ASML

ASML is the world’s leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML.

Media Relations Contact
Lucas van Grinsven – Corporate Communications – +31.40.268.3949 – Veldhoven, NL

Investor Relations Contacts
Craig DeYoung – Investor Relations – +1.480.383.4005 – Veldhoven, NL
Franki D’Hoore – Investor Relations – +31.40.268.6494 – Veldhoven, NL

EX-99.6

Exhibit 99.6

ASML Issued Share Capital Notification

Effective close of business September 28, 2007, in connection with the 8 for 9 reverse stock split, ASML Holding NV’s issued share capital consisted of 440,752,737 Ordinary Shares with a nominal value of EUR 0.09 per share. A corresponding notification has been made with the Netherlands Authority for the Financial Markets (AFM) of the change in ASML’s issued share capital.

Information on ASML’s share capital is publicly available via: www.afm.nl/registers.