JOINT FILING AGREEMENT

THIS JOINT FILING AGREEMENT is entered into as of May 18, 2018, by and among the parties hereto. The undersigned hereby agree that the Statement on Schedule 13D with respect to the common stock, par value US$0.004 per share, of Semiconductor Manufacturing International Corporation and any amendment thereto signed by each of the undersigned shall be filed on behalf of each undersigned pursuant to and in accordance with the provisions of Rule 13d-1(k)(1) under the Securities Exchange Act of 1934, as amended.

Date:  May 18, 2018	China Integrated Circuit Industry Investment Fund Co., Ltd.
		By:	/s/ Wang Zhanfu
			Name:	Wang Zhanfu
			Title:	Authorized Representative
	Xunxin (Shanghai) Capital Co., Limited
		By:	/s/ Wu Fengshuo
			Name:	Wu Fengshuo
			Title:	Authorized Representative
	Xinxin (Hongkong) Capital Co., Limited
		By:	/s/ Wu Fengshuo
			Name:	Wu Fengshuo
			Title:	Authorized Representative